(Senior) Member of Technical Staff / Director, Process Engineering, Advanced Packaging
Originally posted 24 March 2026 by the employer.
Lead process development of high-thermal-conductivity thin films using ALD/PEALD and CVD/PECVD for advanced packaging.
About the role
This role leads a team of process engineering experts driving the development of high-thermal-conductivity thin films for advanced packaging and high-performance computing (HPC) applications. The position leverages ALD/PEALD and CVD/PECVD technologies to turn technical roadmaps into manufacturable solutions for heterogeneous integration across logic, foundry, and memory devices.
What you'll do
- Lead and develop a team of process development engineers focused on high thermal conductivity thin films for advanced packaging and HPC applications. - Own the roadmap to develop thermal films or materials aligned to customer performance and integration requirements. - Leverage ALD/PEALD, CVD/PECVD, and surface preparation expertise to design, optimize, and qualify high thermal conductivity materials and stacks for use in advanced devices and packages. - Drive high thermal conductivity thin film development, including process optimization for deposition rate, uniformity, materials properties, morphology, and bondability. - Define, influence, and drive new hardware requirements in close collaboration with hardware and software engineering teams to meet high thermal conductivity process specifications and integration schemes. - Collaborate with customers, Account Technology Directors, Product Management, and Business Development to align materials roadmaps with customer device and packaging strategies.
What you'll need
- Ph.D. degree in Physics, Physical Chemistry, Chemical Engineering, Materials Science, or a related field. - 10–15+ years of experience in the semiconductor or semiconductor capital equipment industry, including senior-level technical leadership roles. - Proven track record of developing and delivering new semiconductor process technologies to customers. - Strong working knowledge of semiconductor device physics and manufacturing processes. - Demonstrated credibility working with semiconductor fab managers, senior engineers, and executive stakeholders. - Willingness to travel approximately 10–20%.
Skills: ALD, CVD, thermal films, advanced packaging, process development
This role has been open 211 days — well above the 72-day median for Process Engineering roles.
Process Engineering · Semiconductor Process
|
Open roles in category
1052
|
Median days open
72 d
|
Median salary
$137k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | ASM International | All employers we track in this specialty (1052 roles · 56 employers) |
|---|---|---|
| Open roles in this specialty | 26 | 1052 |
| Open roles in the wider Process, Fab & Equipment family | 259 | 10037 · 107 employers |
| Median days open | 171 d | 72 d (+99 d vs this employer) |
| Median salary (USD postings) | — | $137k |
Skills observed across this category: ALD, CVD, thermal films, advanced packaging, process development
Who's hiring in this category
- Micron Technology · 334 open roles · median 132 d
- GlobalFoundries · 88 open roles · median 89 d
- Applied Materials · 79 open roles · median 72 d
- Texas Instruments · 57 open roles · median 55 d
- STMicroelectronics · 50 open roles · median 48 d
- Entegris · 43 open roles · median 44 d
How we counted: 1052 open Process Engineering (Semiconductor Process) roles from 56 employers tracked in the SemiconductorJobs index, counted 26 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.
ASM International
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