Senior Manager, Product Engineering - Austin, United States
Product Engineering & Quality
Originally posted 13 October 2026 by the employer.
Own the end-to-end technical execution and operational governance for advanced multi-chip power modules.
About the role
As the leader of the Module Product Engineering function, you will own the end-to-end technical execution, workforce planning, and operational governance for advanced multi-chip power modules. This role ensures high-yield, high-reliability delivery of semiconductor power products at scale.
What you'll do
- Own workforce planning, hiring, onboarding, skill development, and succession planning for the Product Engineering team.
- Define and maintain global module PE standards for readiness, characterization, yield analysis, qualification, and product change management.
- Represent the Module PE organization in NPI gate reviews, executive escalation forums, customer discussions, and strategic capacity planning.
- Oversee module manufacturability across internal and OSAT manufacturing sites, driving improvements in yield, cycle time, cost, and defect prevention (assembly workmanship, die attach, clip attach, and solder integrity).
- Drive decision-making for quality, yield excursions, production holds, qualification strategy, and customer-facing corrective actions.
- Partner across Design, Test, Quality, Operations, Supply Chain, and Product Management to translate roadmap goals into actionable requirements.
What you'll need
- 10+ years of semiconductor product engineering, manufacturing engineering, or test/quality leadership.
- 5+ years managing technical engineering teams.
- Technical expertise in semiconductor power products, advanced power modules, packaging/assembly processes, qualification, and high-volume manufacturing (HVM).
- Demonstrated track record of establishing operating metrics, yield governance, and execution standards.
- Bachelor’s degree in Electrical Engineering, Mechanical Engineering, Materials Engineering, or related technical field.
Skills: product engineering, NPI, yield analysis, qualification, packaging/assembly processes