Senior Director Package & Assembly Engineering - San Jose, United States
Originally posted 22 September 2026 by the employer.
Lead package and assembly engineering for AI/Datacenter Power programs.
About the role
This role leads the organization responsible for driving the execution of packaging development, new product introduction, and assembly engineering continuous improvement. The scope includes establishing strong program governance and leading cross-functional technical task forces to resolve development challenges.
What you'll do
- Recruit, build, and mentor a new team of Packaging engineers.
- Partner with Package Engineering Directors to provide program-level execution leadership, governance, and accountability.
- Establish and drive end-to-end NPI program plans, milestones, critical paths, resource alignment, risk management, and executive reporting.
- Proactively identify technical, quality, reliability, supply, manufacturing, and schedule risks; establish mitigation plans and escalate critical issues.
- Lead cross-functional technical task forces for major development challenges affecting quality, reliability, yield, manufacturability, qualification, or NPI schedule.
- Lead technical program management activities with key OSAT/CM partners, including program reviews, milestone tracking, and issue escalation.
What you'll need
- Doctorate, Master’s, or Bachelor’s Degree in Electrical Engineering, Materials Science, Electrical Engineering, Physics, Chemistry, or a related technical discipline.
- 15–20+ years of relevant experience in semiconductor engineering, product development, applications, package development, NPI, manufacturing, or technical program management.
- Demonstrated experience leading complex semiconductor NPI programs involving package development, assembly, qualification, reliability, and manufacturing ramp.
- Strong understanding of semiconductor product development process, package and assembly processes.
- Experience working with OSATs/CMs and managing complex development and production activities across geographically distributed organizations.
- Proven track record leading cross-functional technical task forces and resolving complex issues involving quality, reliability, yield, manufacturability, and schedule.
- Strong understanding of qualification, reliability, SPC/statistical methods, process development, risk management, and structured problem-solving methodologies.
- Exceptional program management skills, including critical-path management, risk management, executive escalation, schedule recovery, and cross-functional resource alignment.
Nice to have
- Experience supporting high-growth customer programs.
- Experience with formal technical program management methodologies and portfolio-level governance.
- Experience driving customer-critical NPI programs.
This role has been open 0 days — well below the 57-day median for Process Integration roles.
Process Integration · Advanced Packaging
|
Open roles in category
70
|
Median days open
57 d
|
Median salary
$175k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Renesas Electronics | All employers we track in this specialty (70 roles · 20 employers) |
|---|---|---|
| Open roles in this specialty | 6 | 70 |
| Open roles in the wider Process, Fab & Equipment family | 174 | 9479 · 109 employers |
| Median days open | 38 d | 57 d (−19 d vs this employer) |
| Median salary (USD postings) | — | $175k |
Who's hiring in this category
- Micron Technology · 14 open roles · median 103 d
- GlobalFoundries · 10 open roles · median 92 d
- Intel Corporation · 10 open roles · median 27 d
- Applied Materials · 8 open roles · median 29 d
- Renesas Electronics (this employer) · 6 open roles · median 38 d
- Lumilens · 4 open roles · median 47 d
How we counted: 70 open Process Integration (Advanced Packaging) roles from 20 employers tracked in the SemiconductorJobs index, counted 23 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.