Senior Design Engineer/Principle Design Engineer - Seremban, Malaysia
Originally posted 5 October 2026 by the employer.
About the role
This role involves the design and development of new packing methods, footprints, carrier tapes, and box designs for IC/discrete packages, addressing gaps between design requirements and supplier capabilities.
What you'll do
- Identify technical risks and propose mitigation using design tools such as Design FMEA and simulations.
- Drive sound solutions for packing method, footprint, carrier tape, and box designs.
- Own the packing method, footprint, carrier tape, and box design process.
- Ensure effective implementation of the design process throughout the development life cycle.
- Maintain design rules for footprint, carrier tape, and box that reflect assembly and supplier capabilities.
- Address customers’ physical issues related to our packages, including T&R, SMT, and solderability.
What you'll need
- Degree in engineering disciplines or materials science.
- Knowledge of IC/discrete package design.
- Experience with design tools such as simulation, Design FMEA, and CAD.
- Design experience of solder footprint.
- Strong customer focus, proactive, and able to work with minimal supervision.
- Good interpersonal and presentation skills in cross-site and cross-functional teams.
- Good command of written and spoken English.
Nice to have
- Master degree or higher.
- Experience in handling customer interactions.
- Mandarin language proficiency.
Skills: IC/discrete package design, packing method, footprint design, carrier tape, Design FMEA
This role has been open 1 day — well below the 61-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
196
|
Median days open
61 d
|
Median salary
$161k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Nexperia | All employers we track in this specialty (196 roles · 44 employers) |
|---|---|---|
| Open roles in this specialty | 4 | 196 |
| Open roles in the wider Process, Fab & Equipment family | 97 | 9631 · 109 employers |
| Median days open | 45 d | 61 d (−16 d vs this employer) |
| Median salary (USD postings) | — | $161k |
Skills observed across this category: IC/discrete package design, packing method, footprint design, carrier tape, Design FMEA
Who's hiring in this category
- Infineon Technologies · 25 open roles · median 47 d
- Renesas Electronics · 22 open roles · median 37 d
- Micron Technology · 20 open roles · median 143 d
- onsemi · 13 open roles · median 20 d
- Monolithic Power Systems · 11 open roles · median 200 d
- Intel Corporation · 9 open roles · median 161 d
How we counted: 196 open Packaging Engineering (Packaging) roles from 44 employers tracked in the SemiconductorJobs index, counted 6 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.