Senior Design Engineer, HBM - Richardson, TX, United States
Originally posted 2 June 2026 by the employer.
Focus on High Bandwidth Memory (HBM) product design, sustaining maintenance, and silicon debug within the Heterogeneous Integration Group.
About the role
As an HBM Design Engineer at Micron Technology, you will work closely with cross-functional teams including Design Engineering, Product Engineering, Process Integration, Packaging, and Technology Development to analyze and resolve silicon issues across HBM products. You will collaborate with architecture to understand specification requirements and contribute to the implementation, verification, and maintenance of design updates across product lifecycles.
What you'll do
- Work on HBM product design and support sustaining design maintenance, including ECOs and specification changes. - Own end-to-end debug of silicon, system, and customer issues, driving root-cause analysis and resolution. - Work closely with DE, PE, TD, and system teams to execute issue resolution and ensure alignment on priorities. - Identify and debug yield, reliability, and performance issues to improve product quality. - Support customer bring-up, qualification, and system-level debug activities. - Contribute sustaining learnings to improve design quality, debug efficiency, and verification methodologies.
What you'll need
- 4+ years of experience with a BS or 2+ years with an MS in Electrical Engineering, Computer Engineering, or a related field. - Strong understanding of DRAM/HBM architecture and high-speed memory interfaces. - Experience in digital and/or custom design and verification. - Hands-on experience in silicon debug or post-silicon validation. - Ability to independently drive complex technical issues to closure.
Nice to have
- Experience with HBM/DDR/LPDDR or high-speed IO systems. - Background in system-level debug and silicon-to-system correlation. - Knowledge of timing and margin analysis, signal and power integrity. - Experience with DFT / mBIST / test-mode debug. - Proficiency in scripting languages such as Python or Perl, and experience leveraging AI-assisted tools for design and analysis automation.
This role has been open 155 days — well above the 62-day median for Process Integration roles.
Process Integration · Advanced Packaging
|
Open roles in category
88
|
Median days open
62 d
|
Median salary
$182k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Micron Technology | All employers we track in this specialty (88 roles · 21 employers) |
|---|---|---|
| Open roles in this specialty | 18 | 88 |
| Open roles in the wider Process, Fab & Equipment family | 1486 | 10039 · 106 employers |
| Median days open | 38 d | 62 d (−24 d vs this employer) |
| Median salary (USD postings) | — | $182k |
Who's hiring in this category
- Micron Technology (this employer) · 18 open roles · median 38 d
- SkyWater Technology · 13 open roles · median 3 d
- GlobalFoundries · 11 open roles · median 123 d
- Intel Corporation · 9 open roles · median 74 d
- Applied Materials · 8 open roles · median 37 d
- Renesas Electronics · 7 open roles · median 39 d
How we counted: 88 open Process Integration (Advanced Packaging) roles from 21 employers tracked in the SemiconductorJobs index, counted 24 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.
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