Senior Design Engineer, HBM Architecture - Richardson, TX, United States
$146,000 - $297,000 USD yearly
Originally posted 27 August 2026 by the employer.
About the role
This role focuses on architecting, designing, and optimizing high-speed datapath circuitry for JEDEC and custom High Bandwidth Memory (HBM) solutions. You will define complex system requirements, ensure subsystem integration, and support development through silicon bring-up across logic-die and core-die architectures.
What you'll do
- Architect, design, and optimize logic-die and core-die datapath circuitry for HBM products. - Determine system specifications, input/output processes, and working parameters for hardware and software compatibility. - Coordinate subsystem design and system integration across multi-functional teams. - Identify, analyze, and resolve system or program support deficiencies. - Develop and recommend corrective actions to ensure datapath performance.
What you'll need
- Bachelor’s degree in Electrical Engineering, Computer Engineering, or a related field with 4 years of relevant industry experience, or a Master’s degree with 2 years of relevant experience. - Experience architecting, designing, or optimizing high-speed datapath circuitry. - Experience determining hardware/software system specifications and I/O processes. - Experience coordinating subsystem design and system integration activities. - Demonstrated ability to define complex system requirements, perform root cause analysis, and recommend corrective actions.
Nice to have
- PhD in Electrical Engineering, Computer Engineering, or a related field. - Experience working with JEDEC or custom HBM solutions. - Experience collaborating with design, PHY, ECC, verification, layout, or system engineering teams.
Skills: HBM datapath, logic-die, core-die, high-speed digital datapath, RTL
This role has been open 56 days — well below the 68-day median for Memory Design roles.
Memory Design · Memory Design
|
Open roles in category
310
|
Median days open
68 d
|
Median salary
$200k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Micron Technology | All employers we track in this specialty (310 roles · 30 employers) |
|---|---|---|
| Open roles in this specialty | 157 | 310 |
| Median days open | 87 d | 68 d (+19 d vs this employer) |
| Median salary (USD postings) | — | $200k |
Skills observed across this category: HBM datapath, logic-die, core-die, high-speed digital datapath, RTL
Who's hiring in this category
- Micron Technology (this employer) · 156 open roles · median 89 d
- Synopsys · 32 open roles · median 62 d
- Qualcomm · 19 open roles · median 83 d
- SanDisk · 17 open roles · median 49 d
- Broadcom · 16 open roles · median 63 d
- NVIDIA · 8 open roles · median 44 d
How we counted: 310 open Memory Design (Memory Design) roles from 30 employers tracked in the SemiconductorJobs index, counted 22 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there. Figures refresh nightly.