R&D Engineer - USA-CA San Jose Innovation Drive, United States
$167,500 - $268,000 USD yearly
Originally posted 17 June 2026 by the employer.
About the role
Broadcom is seeking an R&D Engineer to lead multi-chip semiconductor assembly and system pathfinding for artificial intelligence and high-performance computing modules. The position focuses on advanced packaging technology and system-in-package assembly, driving development from early R&D through product introduction and high-volume manufacturing.
What you'll do
- Serve as technical lead for multi-chip semiconductor assembly and system pathfinding across artificial intelligence and high-performance computing modules. - Own key portions of the advanced packaging, assembly, and system technology roadmap, collaborating with internal IC design/validation teams and external foundry R&D groups. - Define technology requirements, roadmaps, evaluation plans, and qualification plans while providing hands-on applications support during transitions to product development. - Manage projects independently from concept through transfer to high-volume manufacturing, coordinating communication with external foundry and assembly collaborators. - Lead problem solving in advanced packaging technology, assess risks, and coordinate cross-functional risk mitigation across concurrent projects.
What you'll need
- Master's degree in Electrical Engineering or related field with 15+ years of experience in semiconductor process technology, advanced packaging, and manufacturing (specifically R&D and integration), or a PhD with 12+ years of relevant experience. - Knowledge of advanced packaging, assembly, and silicon process technologies, including thermal solutions, power delivery, and both electrical and optical communication. - Experience with design of serial and parallel interfaces for chip-to-chip communication within modules and for external module communication. - Experience with parametric and yield data analysis, statistical data analysis tools, and yield failure mechanisms and root cause tools including EFA and PFA. - Experience with thermal and stress simulation tools.
This role has been open 163 days — well above the 59-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
302
|
Median days open
59 d
|
Median salary
$167k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Broadcom | All employers we track in this specialty (302 roles · 59 employers) |
|---|---|---|
| Open roles in this specialty | 3 | 302 |
| Open roles in the wider Process, Fab & Equipment family | 40 | 10039 · 106 employers |
| Median days open | 143 d | 59 d (+84 d vs this employer) |
| Median salary (USD postings) | — | $167k |
Who's hiring in this category
- KLA Corporation · 42 open roles · median 135 d
- Micron Technology · 40 open roles · median 41 d
- Renesas Electronics · 21 open roles · median 45 d
- Intel Corporation · 20 open roles · median 27 d
- GlobalFoundries · 14 open roles · median 67 d
- Lumilens · 13 open roles · median 78 d
How we counted: 302 open Packaging Engineering (Advanced Packaging) roles from 59 employers tracked in the SemiconductorJobs index, counted 24 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.