Product Release Engineer - Milpitas, CA, United States
$95,000 - $161,500 USD yearly
Originally posted 11 June 2026 by the employer.
Support Engineering Change Orders (ECOs) and product structures in ENOVIA and SAP for the Surfscan product division.
About the role
The Product Release Engineer supports engineering documentation and configuration management for semiconductor metrology and inspection platforms. In this role, you will manage product structures, bills of materials (BOMs), and Engineering Change Orders (ECOs) within the Surfscan product division.
What you'll do
- Support execution of Engineering Change Orders (ECOs) in PLM (ENOVIA) and ERP (SAP) systems. - Maintain product structures, BOMs, and revision data to ensure consistency across engineering and manufacturing systems. - Collaborate with mechanical, electrical, optical, and software engineering teams to gather release documentation, drawings, and specifications. - Perform basic data validation and quality checks to ensure documentation completeness and accuracy prior to release. - Work with Manufacturing, Supply Chain, Quality, and Service teams to resolve routine release-related questions and documentation gaps. - Track assigned ECO tasks and follow established configuration management workflows to meet release schedules.
What you'll need
- Bachelor's degree in Mechanical, Electrical, Manufacturing, or a related field with 2+ years of experience, or a Master's degree with 0+ years of experience. - Experience in manufacturing, engineering, or product data management. - Familiarity with engineering documentation including drawings, BOMs, and specifications. - Exposure to PLM or ERP systems such as ENOVIA or SAP. - Knowledge of structured data management practices and configuration management workflows.
Nice to have
- Exposure to PLM/ERP systems (ENOVIA, SAP or similar).
This role has been open 134 days — well above the 59-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
305
|
Median days open
59 d
|
Median salary
$167k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | KLA Corporation | All employers we track in this specialty (305 roles · 59 employers) |
|---|---|---|
| Open roles in this specialty | 42 | 305 |
| Open roles in the wider Process, Fab & Equipment family | 512 | 10080 · 106 employers |
| Median days open | 134 d | 59 d (+75 d vs this employer) |
| Median salary (USD postings) | — | $167k |
Who's hiring in this category
- KLA Corporation (this employer) · 44 open roles · median 134 d
- Micron Technology · 40 open roles · median 43 d
- Renesas Electronics · 21 open roles · median 44 d
- Intel Corporation · 19 open roles · median 29 d
- GlobalFoundries · 14 open roles · median 66 d
- Lumilens · 13 open roles · median 77 d
How we counted: 305 open Packaging Engineering (Advanced Packaging) roles from 59 employers tracked in the SemiconductorJobs index, counted 23 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.