$111,900 - $190,200 USD yearly
Originally posted 28 May 2026 by the employer.
About the role
Responsible for assessment of existing and potential markets, product lifecycle planning, customer requirement analysis, pricing analysis, and technical product development coordination. This role supports the ADE business unit focused on patterned and unpatterned wafer geometry measurements across wafer to wafer and die to wafer bonding applications.
What you'll do
- Direct the development of market requirements for specific products or product lines, including product strategy definition, requirements analysis, and pricing. - Represent marketing in product life cycle meetings and coordinate with engineering, manufacturing, and sales to enhance products. - Define product adoption strategies for assigned regional accounts and support pre-sales and after-sales projects. - Develop technical product presentations and present them directly to key semiconductor customers. - Perform market research, monitor competitive activity, and compile customer information and industry reports to build capacity models for demand forecasting. - Act as the central point of contact between customer accounts and the division while collaborating with regional teams.
What you'll need
- Bachelor's degree with 5 years of related work experience, Master's degree with 3 years of related work experience, or a Doctorate degree. - Semiconductor cleanroom/fab process knowledge in CVD, PVD, Overlay, Lithography, or Advanced Packaging. - Experience delivering technical presentations and managing semiconductor customer engagements. - Experience performing market analysis, competition analysis, and building capacity models in MS Excel. - Applications development experience in metrology or inspection. - Willingness to travel for business 30% to 50% of the time.
This role has been open 149 days — well above the 59-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
302
|
Median days open
59 d
|
Median salary
$167k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | KLA Corporation | All employers we track in this specialty (302 roles · 59 employers) |
|---|---|---|
| Open roles in this specialty | 42 | 302 |
| Open roles in the wider Process, Fab & Equipment family | 511 | 10039 · 106 employers |
| Median days open | 135 d | 59 d (+76 d vs this employer) |
| Median salary (USD postings) | — | $167k |
Who's hiring in this category
- KLA Corporation (this employer) · 42 open roles · median 135 d
- Micron Technology · 40 open roles · median 41 d
- Renesas Electronics · 21 open roles · median 45 d
- Intel Corporation · 20 open roles · median 27 d
- GlobalFoundries · 14 open roles · median 67 d
- Lumilens · 13 open roles · median 78 d
How we counted: 302 open Packaging Engineering (Advanced Packaging) roles from 59 employers tracked in the SemiconductorJobs index, counted 24 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.