Product Engineer - Sherman, TX, United States
Product Engineering & Quality
Originally posted 6 August 2026 by the employer.
This role focuses on InP optoelectronic devices for datacom applications.
About the role
This Product Engineer role leads cross-functional teams to investigate yield excursions, identify root causes, and implement corrective and preventive actions, owning yield bridge activities to support new product introduction and transition to high-volume manufacturing for InP optoelectronic devices for datacom applications.
What you'll do
- Lead analysis of failures on wafer fabrication and testing production lines.
- Support new product introduction of optoelectronic chips such as VCSEL, DFB laser, detector, and photonic integrated chips for 3D sensing applications.
- Perform design/process sensitivity studies to define EPI/process spec limits.
- Lead efforts to drive production ramp-up readiness, coordinating with cross-functional teams.
- Drive yield improvement and product cost reduction post-production ramp through statistical data analysis.
- Support cost modeling and facilitate actions/decisions for cost-competitive products.
What you'll need
- Hands-on experience with design, process, and characterization of optoelectronic devices such as VCSEL, DFB laser, or photonic integrated chips.
- Strong statistical data analysis skills (JMP, Minitab, or similar tools).
- Masters or PhD in electrical engineering, physics, material science, or equivalent knowledge/experience.
- 10+ years professional experience.
- Proficiency with statistical process control, design of experiments, and database query.
- Understanding of device physics and the impact of process parameters on performance.
Nice to have
- Familiarity with semiconductor wafer fab operations (Manufacturing Execution System, process, and quality control, change management etc.) in a high-volume manufacturing environment.
- Experience with optoelectronic device reliability testing and modeling.
Skills: yield bridge, NPI, optoelectronic device, VCSEL, DFB laser, photonic integrated chips