Process Engineer – Advanced Semiconductor Packaging - US-CA-Santa Rosa-Bldg 2, United States
$126,930 USD yearly
Originally posted 15 April 2026 by the employer. Relisted by the employer on 18 August 2026.
Lead System in Package (SiP) assembly and heterogeneous integration for InP and GaAs microfabrication platforms.
About the role
This role leads process research and development, process integration, and New Product Introduction for System in Package (SiP) modules integrated with microwave and mmWave subsystems. Packaging processes support proprietary indium phosphide (InP) and gallium arsenide (GaAs) semiconductor platforms at Keysight's High Frequency Technology Center (HFTC).
What you'll do
- Develop and maintain wafer fabrication and package assembly processes. - Specify, select, and qualify new equipment while contributing to process automation. - Review new designs for manufacturability and provide technical feedback to module designers. - Lead technical development of new SiP introductions in collaboration with upstream design, process, manufacturing, and downstream customer teams.
What you'll need
- BS, MS, or PhD in Mechanical Engineering, Manufacturing Engineering, Materials Science, Physics, Chemistry, or relevant fields with 5+ years of applicable experience in semiconductor fabrication or advanced packaging processes. - Proven expertise in three or more of the following: design for manufacturing of electromechanical assemblies; statistical process control (SPC) and design of experiments (DOE); thermocompression or flip chip bonding; Surface Mount Technology (SMT) processes; die singulation; semiconductor fabrication processes; heterogeneous integration and advanced packaging techniques; or new technology / new product introduction. - Must be a U.S. citizen, lawful permanent resident of the U.S., or protected individual authorized for export-controlled items under U.S. export control laws.
Nice to have
- Experience with III-V compound semiconductors and/or silicon technologies. - Knowledge of thermal, mechanical, and electrical reliability. - Experience with technical project management and the product project lifecycle.
Skills: InP, GaAs, MMICs, compound semiconductor manufacturing, System in Package, microwave, mmWave
This role has been open 192 days — well above the 61-day median for Compound Semiconductor Engineering roles.
Compound Semiconductor Engineering · Compound Semiconductor
|
Open roles in category
65
|
Median days open
61 d
|
Median salary
—
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Keysight Technologies | All employers we track in this specialty (65 roles · 25 employers) |
|---|---|---|
| Open roles in this specialty | 3 | 65 |
| Median days open | 40 d | 61 d (−21 d vs this employer) |
| Median salary (USD postings) | — | — |
Skills observed across this category: InP, GaAs, MMICs, compound semiconductor manufacturing, System in Package, microwave
Who's hiring in this category
- Infineon Technologies · 10 open roles · median 60 d
- Coherent Corp · 7 open roles · median 123 d
- Lumentum · 6 open roles · median 110 d
- STMicroelectronics · 4 open roles · median 70 d
- Texas Instruments · 4 open roles · median 44 d
- Keysight Technologies (this employer) · 3 open roles · median 40 d
How we counted: 65 open Compound Semiconductor Engineering (Compound Semiconductor) roles from 25 employers tracked in the SemiconductorJobs index, counted 25 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there. Figures refresh nightly.
Similar Jobs
Microelectronics Packaging Characterization & Diagnostics Engineer - Kissimmee, FL 34744, USA
SkyWater Technology · 200 NeoCity Wy, Kissimmee, FL 34744, USA
Manufacturing Senior Manager - Austin, TX 78741, USA
SkyWater Technology · 5204 E Ben White Blvd, Austin, TX 78741, USA