Originally posted 30 July 2026 by the employer — open 49 days.
About the role
This role involves developing, optimizing, and sustaining semiconductor fabrication processes for GaAs, GaN, and acoustic wave technology. The focus is on back-end processes including wafer bonding, wafer thinning, and singulation.
What you'll do
- Develop, optimize, and sustain semiconductor fabrication processes for GaAs, GaN, and acoustic wave technology.
- Transfer newly developed processes into high volume manufacturing.
- Implement defect reduction and yield ramp activities.
- Manage SPC and cycle time reduction efforts.
- Support back-end processes including wafer bonding and de-bonding, wafer thinning, singulation, and pick-and-place.
What you'll need
- BS in Physics, Chemistry, Engineering, Materials, or other physical sciences.
- 2+ years of semiconductor processing experience.
- Grasp of semiconductor device fundamentals, including solid-state physics concepts, transistor characterization, and integration of multi-layer interconnects.
- Ability to use the scientific method in solving problems, including design of experiments and statistical analysis.
- Hands-on experience with fragile thinned wafers, dicing frames, cleaning of wafers with solvents and aqueous solutions, and use of adhesives for temporary bonding.
Nice to have
- Expertise in wafer bonding and de-bonding, wafer thinning, singulation, and pick-and-place.
Skills: semiconductor fabrication, GaAs, GaN, wafer bonding, wafer thinning, defect reduction
This role has been open 48 days — well below the 81-day median for Process Engineering roles.
Process Engineering · Semiconductor Process
|
Open roles in category
1042
|
Median days open
81 d
|
Median salary
$148k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | QORVO | All employers we track in this specialty (1042 roles · 59 employers) |
|---|---|---|
| Open roles in this specialty | 18 | 1042 |
| Open roles in the wider Process, Fab & Equipment family | 47 | 9320 · 108 employers |
| Median days open | 17 d | 81 d (−64 d vs this employer) |
| Median salary (USD postings) | — | $148k |
Skills observed across this category: semiconductor fabrication, GaAs, GaN, wafer bonding, wafer thinning, defect reduction
Who's hiring in this category
- Micron Technology · 352 open roles · median 133 d
- Applied Materials · 92 open roles · median 132 d
- GlobalFoundries · 72 open roles · median 86 d
- STMicroelectronics · 48 open roles · median 66 d
- Texas Instruments · 44 open roles · median 29 d
- Entegris · 40 open roles · median 28 d
How we counted: 1042 open Process Engineering (Semiconductor Process) roles from 59 employers tracked in the SemiconductorJobs index, counted 17 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.