Process and Integration Engineer - US-CA-Santa Rosa-Bldg 4, United States

Originally posted 9 October 2026 by the employer.

About the role

This role involves developing advanced manufacturing processes for electronic test and measurement technologies and supporting New Product Introduction (NPI) activities to transform designs into manufacturable products.

What you'll do

• Participate in Design for Manufacturability (DFM) reviews and collaborate with cross-functional teams to improve manufacturability and production readiness.
• Utilize CAD, statistical analysis software, automation tools, and laboratory equipment to develop, qualify, and optimize advanced microcircuit assembling processes including epoxy dispensing, component placement, gold-gold thermosonic bonding (wire bonding, ball bonding, stud bumping, flip chip), soldering, and silver sintering.
• Perform hands-on experimentation, characterization, environmental testing, and troubleshooting to improve product quality, manufacturability, and yield in a New Product Introduction (NPI) environment.
• Design and develop tooling, fixtures, and equipment to support assembly, process validation, and product testing.
• Create and maintain process documentation, work instructions, engineering reports, and manufacturing specifications.
• Contribute to continuous improvement initiatives focused on manufacturing efficiency, product quality, reliability, and process capability.

What you'll need

• Bachelor's in Materials Science, Mechanical Engineering, Chemical Engineering, Physics, Manufacturing Engineering, Electrical Engineering, or a related engineering discipline.
• 4-5 years of relevant experience, or an equivalent combination of education and experience.
• Hands-on experience with manufacturing process development, process optimization, Design of Experiments (DOE), or technical problem solving in a manufacturing or R&D environment.
• Strong analytical and problem-solving skills with the ability to interpret experimental data and identify process improvements.
• Experience collaborating with cross-functional engineering and manufacturing teams.
• ITAR clearance.

Nice to have

• Experience with microelectronics, microcircuit assembly, semiconductor packaging, or precision manufacturing processes.
• Experience with high frequency interconnect and connectorization for RF applications.
• Experience working in a New Product Introduction (NPI) environment.
• Experience designing tooling, fixtures, or manufacturing equipment.
• Hands-on experience with one or more of the following: Epoxy dispensing, Component placement, Wire bonding, Stud bumping, Flip-chip or thermocompression bonding, Soldering, Plasma cleaning.
• Experience using statistical analysis tools such as JMP or Minitab.
• Experience with CAD software such as Siemens NX or PTC Creo.
• Programming or automation experience using Python or similar scripting languages.
• Knowledge of Design for Manufacturability (DFM), Design of Experiments (DOE), statistical process control (SPC), or root cause analysis methodologies.