Principal Research Scientist - Richardson, TX, United States

Originally posted 7 July 2026 by the employer.

About the role

Qorvo is seeking a Principal Research Scientist to serve as a principal investigator and technical contributor leading the development of wafer-level interconnects (BEOL), wafer-level packaging (WLP), and heterogeneous integration technologies. The role involves guiding R&D teams, securing funded programs, and transitioning research concepts into manufacturable solutions for integrated circuit and packaging applications.

What you'll do

- Lead research initiatives in wafer-level interconnects, BEOL, WLP, and heterogeneous integration as a principal investigator. - Author and influence technology roadmaps aligned with long-term product and innovation strategies. - Drive proposal development, technical shaping, capture, and execution of externally funded programs. - Direct hands-on process ideation, development, pathfinding, troubleshooting, and execution for wafer and packaging technologies. - Direct technicians, junior engineers, and process engineers to execute development activities in cleanroom environments. - Generate intellectual property, including patents, invention disclosures, and proprietary process know-how.

What you'll need

- Ph.D. in Materials Science, Electrical Engineering, Mechanical Engineering, Chemical Engineering, Physics, or a related technical field. - 8+ years of hands-on semiconductor R&D experience in cleanroom fabrication environments. - Demonstrated expertise in semiconductor BEOL processing and wafer-level packaging (WLP) technologies. - Hands-on experience with advanced metallization, dielectric integration, and interconnect process development. - Proven experience leading and guiding multidisciplinary R&D teams. - Experience with proposal development, technical reporting, and technical presentations.

Nice to have

- 3+ years of experience serving as a Principal Investigator or technical lead for advanced R&D programs. - GaN RF transistor fabrication experience. - Experience leading or executing R&D programs sponsored by U.S. Government agencies such as DARPA or AFRL. - Expertise in 3D heterogeneous integration (3DHI), including wafer-to-wafer bonding, die-to-wafer bonding, Cu-Cu hybrid bonding, wafer thinning, lap/grind, and TSV technologies. - Hands-on experience with semiconductor process modules including lithography (stepper or e-beam), etch, metallization, CMP, and SEM/FIB analysis. - Experience with device processing and DC/RF characterization, including S-parameters and load-pull measurements.