$129,400 - $247,800 USD yearly
Lead advanced failure analysis across digital CMOS, HBJT RF devices, and wire-bond or flip chip packaging at Skyworks.
About the role
Lead advanced failure analysis across component, module, and system levels to isolate electronic module and device-level failures. This role drives root cause identification and lab investigations across semiconductor chips, surface mount components, printed circuit boards, and wire-bond and flip chip modules.
What you'll do
- Perform failure analysis investigations and troubleshoot electronic components including semiconductor chips, surface mount components, printed circuit boards, wire-bond, and flip chip modules.
- Devise and execute parametric, RF, and system-level testing for fault isolation and root cause determination using digital CMOS and HBJT RF constructs.
- Develop and implement new failure analysis methodologies and analytical tools to isolate failures early in product development and packaging.
- Provide guidance to design, quality, and test engineering teams to influence design-for-reliability decisions and corrective actions.
- Mentor junior engineers and technicians while driving cross-functional initiatives to resolve critical failures.
- Prepare and deliver technical reports and recommendations to senior management and customers regarding reliability standards.
What you'll need
- BS degree in Electrical or Computer Engineering with 8+ years of relevant experience, or MS degree with 6+ years in failure analysis and reliability engineering.
- Demonstrated expertise in digital CMOS, RF device fundamentals, and advanced circuit analysis.
- Extensive experience with failure analysis tools including SEM, CSAM, X-ray CT, IR/NIR microscopy, and wet/dry etching techniques.
- Strong proficiency in PCB and IC design tools alongside RF and parametric test equipment.
- Proficiency in Microsoft Office software including Outlook, Word, Excel, and PowerPoint.
Nice to have
- Familiarity with Focused Ion Beam (FIB) and Scanning Electron Microscope (SEM) failure analysis techniques.
- Understanding of Si and GaAs wafer processes, including wet/dry etching, photolithography, dielectric deposition, and etching.
- Experience with mechanical polishing, sample preparation techniques, and IC packaging technologies including wire-bond, flip-chip, and molding processes.
- Familiarity with advanced packaging methods and emerging semiconductor materials.
More semiconductor jobs: Failure analysis jobs · California jobs
This role has been open 163 days — well above the 41-day median for Failure Analysis Engineering roles.
Failure Analysis Engineering · Failure Analysis
|
Open roles in category
229
|
Median days open
41 d
|
Category median salary (all employers)
$108k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Skyworks | All employers we track in this specialty (229 roles · 43 employers) |
|---|---|---|
| Open roles in this specialty | 4 | 229 |
| Open roles in the wider Process, Fab & Equipment family | 153 | 10057 · 117 employers |
| Median days open | 81 d | 41 d (+40 d vs this employer) |
| Median salary (USD postings) | — | $108k |
Who's hiring in this category
- Micron Technology · 45 open roles · median 27 d
- Lam Research · 18 open roles · median 29 d
- Infineon Technologies · 15 open roles · median 40 d
- SanDisk · 14 open roles · median 9 d
- GlobalFoundries · 13 open roles · median 47 d
- Intel Corporation · 10 open roles · median 29 d
How we counted: 229 open Failure Analysis Engineering (Failure Analysis) roles from 43 employers tracked in the SemiconductorJobs index, counted 8 Nov 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.