Principal Module and FA Lead
Originally posted 31 July 2026 by the employer.
About the role
This role owns module integration and system-level failure analysis across mechanical, electrical, thermal, firmware, and optical/photonics domains during pre-production and early-volume phases.
What you'll do
- Serve as the focal point for module integration and system-level failure triage, diagnosing multi-domain issues and driving resolution.
- Own system-level integration of the module across mechanical, electrical, thermal, firmware, and optical/photonics subsystems to resolve interface, fit, tolerance stack-up, and cross-domain interaction issues.
- Partner with the NPI team to establish module integration procedures, entry/exit criteria, integration test flows, and tracking KPIs for high-volume contract manufacturing transitions.
- Lead structured root-cause investigations using fishbone analysis and staged design of experiments (DOE) to triage variables before full characterization runs.
- Drive verified root-cause countermeasures to closure via design or process changes, feeding learnings into NPI process refinement.
- Build and own the failure analysis documentation and trend-tracking system from scratch.
What you'll need
- BS+15, MS+12, or PhD+9 years in hardware failure analysis, systems engineering, or related root-cause engineering roles, with a degree in Electrical Engineering, Mechanical Engineering, Physics/Applied Physics, Materials Science, Optical Engineering, or related field.
- Working technical fluency across mechanical, electrical, thermal, and firmware domains.
- Demonstrated experience leading cross-domain root-cause investigations on coupled, multi-variable failure modes.
- Hands-on experience operating test and measurement setups with structured, repeatable problem-solving methods.
- Practical experience designing and prioritizing DOEs under real-world constraints such as limited samples and long test cycles.
- Experience building first-principles models (thermal, electrical, mechanical) to narrow candidate variables prior to physical testing.
Nice to have
- Direct photonics/optical packaging experience (fiber coupling, wire-bond/die-attach processes, epoxy and encapsulation materials).
- Pragmatic judgment balancing depth versus speed under schedule pressure.
- Collaborative, root-cause-first mindset over a quality enforcement approach.
Skills: failure analysis, root cause, DOE, module integration, photonics packaging
More semiconductor jobs: Failure analysis jobs
This role has been open 0 days — well below the 41-day median for Failure Analysis Engineering roles.
Failure Analysis Engineering · Failure Analysis
|
Open roles in category
221
|
Median days open
41 d
|
Category median salary (all employers)
$95k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Xscape Photonics | All employers we track in this specialty (221 roles · 40 employers) |
|---|---|---|
| Open roles in this specialty | 1 | 221 |
| Open roles in the wider Process, Fab & Equipment family | 2 | 10088 · 116 employers |
| Median days open | 0 d | 41 d (−41 d vs this employer) |
| Median salary (USD postings) | — | $95k |
Skills observed across this category: failure analysis, root cause, DOE, module integration, photonics packaging
Who's hiring in this category
- Micron Technology · 45 open roles · median 35 d
- Infineon Technologies · 15 open roles · median 36 d
- Lam Research · 14 open roles · median 41 d
- Western Digital · 14 open roles · median 22 d
- GlobalFoundries · 13 open roles · median 42 d
- SanDisk · 12 open roles · median 4 d
How we counted: 221 open Failure Analysis Engineering (Failure Analysis) roles from 40 employers tracked in the SemiconductorJobs index, counted 3 Nov 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.