Principal HBM Design Architect - Richardson, TX, United States
Originally posted 8 June 2026 by the employer.
This role focuses on designing, simulating, optimizing, and floorplanning advanced DRAM circuits for High Bandwidth Memory products.
About the role
This role involves designing, simulating, optimizing, and floorplanning advanced DRAM circuits for High Bandwidth Memory products. You will work across digital, analog, and mixed-signal domains to ensure functional correctness, performance, and power efficiency.
What you'll do
- Design, simulate, and optimize DRAM memory arrays, data paths, ECC, command/control logic, and high-speed interface circuits
- Evaluate block-level and full-chip functionality and propose solutions to ensure functional correctness
- Analyze timing, area, power, and complexity trade-offs in high-speed DRAM and mixed-signal designs
- Perform pathfinding and feasibility studies for new architectures and future HBM products
- Contribute to the design, layout, and optimization of memory, logic, and analog circuits
- Support large-scale verification, debug, and silicon validation activities
- Collaborate across multi-functional teams involved in TSV-based 3D stacking and vertical integration
What you'll need
- BSEE with 7+ years or MSEE with 5+ years of relevant engineering experience
- Strong knowledge of CMOS circuit design and semiconductor device physics
- Experience with schematic entry and simulation using FineSim, HSPICE, or equivalent tools
- Experience with power delivery and power network analysis
- Proficiency in scripting languages such as Python, Tcl, or Perl
Nice to have
- Familiarity with DRAM or memory subsystem design
Skills: DRAM memory arrays, data paths, ECC, command/control logic, high-speed interface circuits, CMOS circuit design, HBM products
This role has been open 200 days — well above the 69-day median for Memory Design roles.
Memory Design · Memory Design
|
Open roles in category
287
|
Median days open
69 d
|
Median salary
$205k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Micron Technology | All employers we track in this specialty (287 roles · 29 employers) |
|---|---|---|
| Open roles in this specialty | 153 | 287 |
| Median days open | 86 d | 69 d (+17 d vs this employer) |
| Median salary (USD postings) | — | $205k |
Skills observed across this category: DRAM memory arrays, data paths, ECC, command/control logic, high-speed interface circuits, CMOS circuit design
Who's hiring in this category
- Micron Technology (this employer) · 151 open roles · median 86 d
- Synopsys · 27 open roles · median 49 d
- SanDisk · 17 open roles · median 32 d
- Broadcom · 16 open roles · median 50 d
- Qualcomm · 12 open roles · median 149 d
- NVIDIA · 7 open roles · median 59 d
How we counted: 287 open Memory Design (Memory Design) roles from 29 employers tracked in the SemiconductorJobs index, counted 5 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there. Figures refresh nightly.