$308,600 - $417,500 USD yearly
Originally posted 1 June 2026 by the employer.
About the role
As part of the Solutions Engineering CAD team, you will focus on floor-planning, power delivery network (PG Mesh) methodologies, and technology-node-aware implementation solutions for high-performance and low-power designs. You will develop scalable methodologies and automation for floor-planning, PDN design, power integrity, thermal-aware implementation, and PPA optimization across complex SoC and multi-die implementations.
What you'll do
- Deliver tool-flow-methodology and automation across design and implementation flows. - Develop and execute SoC floor-planning methodologies for complex hierarchical and multi-die designs. - Define and optimize power delivery network (PDN) implementation for advanced-node designs, including IR/EM-aware planning and power integrity optimization. - Build scalable automation and methodologies for top level floor-planning, power mesh and clocking, hierarchical subsystems, IO and IP integration, routing resource congestion analysis, and technology-node-aware implementation flows. - Implement methodology updates for advanced technology nodes, ultra-low voltage designs, and chiplet/multi-die systems. - Partner with architecture, RTL, IP, physical design, package-board teams, foundries, and EDA partners.
What you'll need
- Expertise in SoC design flow automation for hierarchical floor-planning, PDN design, and advanced physical implementation methodologies. - Programming and scripting skills including Python, C, EDA tools, version control systems (Git), and distributed processing/debug environments. - Hands-on experience with low-power design methodologies, UPF-based design, chip finishing, and physical verification flows in advanced process technologies. - Track record of leading technical initiatives across engineering teams, foundries, and ecosystem partners.
Nice to have
- Deep understanding of advanced clocking structures, power delivery optimization, and physical verification convergence techniques. - Familiarity with AI-assisted design automation and methodology optimization flows.
Skills: floor-planning, power delivery network, SoC design flow automation, advanced physical implementation, multi-die designs