Principal Applications Engineer, Transistor-Level Signoff
Totem and Totem-SC power integrity and EM/IR signoff for advanced nodes and 3DIC designs.
Originally posted 3 November 2026 by the employer.
About the role
As a Principal Applications Engineer, you will own technical customer relationships and drive transistor-level power integrity and EM/IR signoff methodologies across analog, RF, ESD, embedded memory, and high-speed interface designs. The role focuses on customer engagements, signoff flow optimization, and technical issue resolution using Totem and Totem-SC.
What you'll do
- Own technical relationships with assigned customer accounts as the primary technical contact for Totem and Totem-SC engagements, driving adoption and methodology development.
- Lead transistor-level power integrity and EM/IR signoff work across analog, RF, ESD, embedded memory, and high-speed interface designs to validate results and resolve root causes.
- Develop, validate, and optimize signoff flows for advanced nodes and 3DIC designs using Python, Tcl, Perl, or Shell scripting.
- Drive complex technical investigations from customer reports through root-cause analysis, coordinating with R&D and internal teams.
- Lead technical evaluations, benchmarks, workshops, and training sessions in partnership with Sales.
- Mentor applications engineers on signoff methodology, power-integrity analysis, and customer engagement best practices.
What you'll need
- Bachelor's or Master's degree in Electrical Engineering, Electronics Engineering, or equivalent practical experience.
- Typically 10 or more years in semiconductor EDA, IC design, or applications engineering, with substantial customer-facing technical experience.
- Strong hands-on experience with transistor-level EM/IR, power-integrity, power-grid extraction, or related signoff solutions.
- Solid understanding of analog and custom IC design, circuit analysis, physical layout, and semiconductor signoff methodology.
- Familiarity with semiconductor design data and EDA flows, including SPICE netlists, SPEF, DSPF, and layout databases.
- Proficiency in UNIX/Linux environments and scripting in Python, Tcl, Perl, or Shell.
Nice to have
- Direct experience with Totem or Totem-SC.
- Experience in analog/RF, ESD, embedded memory/IP, or high-speed interface design.
- Experience with 3DIC, multi-die integration, or associated power-integrity and signoff flows.
- Familiarity with advanced semiconductor technologies, including FinFET and GAA.
- Experience applying AI, machine learning, LLMs, or agent-based automation to engineering productivity, technical support, data analysis, or EDA workflows.
Skills: Totem, EM/IR, power integrity, signoff, EDA
More semiconductor jobs: Synopsys jobs · Field applications engineer jobs · Taiwan jobs
This role has been open 0 days — well below the 41-day median for Applications FAE roles.
Applications FAE · EDA Tools
|
Open roles in category
127
|
Median days open
41 d
|
Category median salary (all employers)
$182k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Synopsys | All employers we track in this specialty (127 roles · 10 employers) |
|---|---|---|
| Open roles in this specialty | 67 | 127 |
| Median days open | 34 d | 41 d (−7 d vs this employer) |
| Median salary (USD postings) | — | $182k |
Skills observed across this category: Totem, EM/IR, power integrity, signoff, EDA
Who's hiring in this category
- Synopsys (this employer) · 69 open roles · median 34 d
- Cadence Design Systems · 35 open roles · median 37 d
- Keysight Technologies · 9 open roles · median 70 d
- Renesas Electronics · 6 open roles · median 83 d
- ASML · 2 open roles · median 32 d
- GlobalFoundries · 2 open roles · median 62 d
How we counted: 127 open Applications FAE (EDA Tools) roles from 10 employers tracked in the SemiconductorJobs index, counted 5 Nov 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there. Figures refresh nightly.