$230,000 - $275,000 USD yearly
Originally posted 3 September 2026 by the employer — open 6 days.
About the role
This role is responsible for defining and driving power delivery architecture and strategy for high-performance compute, AI/ML accelerators, and advanced ASIC platforms.
What you'll do
- Lead system architecture exploration focusing on power delivery and thermal management.
- Collaborate with product, ASIC, and systems teams to define detailed power specifications.
- Architect power delivery systems optimized for electrical performance and cooling efficiency.
- Evaluate and select optimal architectures and strategic partners for new technology development.
- Oversee the full lifecycle of power delivery solutions from concept through production deployment.
- Collaborate with package, silicon, PCB, and mechanical teams to optimize power delivery.
What you'll need
- MSEE or MSCE; PhD or equivalent industry experience preferred.
- 15+ years of hands-on experience in power delivery systems.
- Strong foundation in energy-efficient system design and associated trade-offs.
- Practical experience in thermal modeling and cooling solution implementation.
- Experience with high-current, low-voltage power delivery for advanced silicon.
- Experience with multiphase buck regulators, digital power controllers, DrMOS, smart power stages, and integrated voltage regulators.
- Experience working on server hardware, AI accelerators, hardware accelerator, datacenter, AI Hardware, enterprise product, GPU, CPU, TPU, or server platform.
Nice to have
- Demonstrated expertise in DC-DC power conversion, including control loops, power management, magnetics, and filter design.
- Solid background in semiconductor technologies, including PMICs and integrated power modules.
- Deep technical knowledge of magnetic components, particularly in custom inductor design.
- Experience in developing advanced power modules with optimized thermal and magnetic characteristics.
- Experience on package PDN design, power vias, bumps, interposers, substrates, and ASIC power delivery structure.
- Deep expertise on power architecture for chiplet-based designs, IVRs, advanced packages, or 2.5D/3D integration.
Skills: power delivery, thermal management, multiphase buck regulators, digital power controllers, chiplet-based designs
This role has been open 6 days — well below the 61-day median for Power Electronics roles.
Power Electronics · Power Management
|
Open roles in category
72
|
Median days open
61 d
|
Median salary
$178k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Cerebras | All employers we track in this specialty (72 roles · 28 employers) |
|---|---|---|
| Open roles in this specialty | 1 | 72 |
| Open roles in the wider Analog & Mixed-Signal family | 1 | 1320 · 101 employers |
| Median days open | 6 d | 61 d (−55 d vs this employer) |
| Median salary (USD postings) | — | $178k |
Skills observed across this category: power delivery, thermal management, multiphase buck regulators, digital power controllers, chiplet-based designs
Who's hiring in this category
- Renesas Electronics · 15 open roles · median 65 d
- Qualcomm · 7 open roles · median 34 d
- Monolithic Power Systems · 6 open roles · median 174 d
- Analog Devices · 5 open roles · median 65 d
- Infineon Technologies · 5 open roles · median 62 d
- AMD · 4 open roles · median 82 d
How we counted: 72 open Power Electronics (Power Management) roles from 28 employers tracked in the SemiconductorJobs index, counted 10 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Analog & Mixed-Signal family row. Figures refresh nightly.