Packaging Module Equipment Development Engineer - Arizona, Phoenix, United States
$133,800 - $188,890 USD yearly
Originally posted 27 May 2026 by the employer. Relisted by the employer on 20 August 2026.
About the role
As a Packaging Module Development Engineer on Intel's Packaging Module Development team, you will develop assembly processes and refine equipment to support packaging solutions and manufacturing.
What you'll do
- Develop and optimize assembly processes and equipment to meet quality, reliability, cost, yield, productivity, and manufacturability goals. - Apply Design of Experiments (DOE) principles and statistical methods to refine processes, specifications, and equipment capabilities, documenting findings through technical reports. - Ensure manufacturability of physical layouts in package designs, overseeing manufacturing equipment health and reliability from development through high-volume manufacturing. - Support integration of new materials and architectures into equipment for advanced foundry customer product manufacturability. - Innovate new techniques, tools, and quality screens to proactively identify and address equipment health and reliability issues. - Standardize equipment qualification practices and manufacturing quality systems while addressing technical risks aligned with product milestones.
What you'll need
- US Citizenship. - Bachelor's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field with 2+ years of relevant experience, or a Master's degree with 1+ years of experience, or a PhD. - Proficiency in Statistical Process Control (SPC) and Design of Experiments (DOE) principles.
Nice to have
- Experience with high-volume manufacturing including equipment troubleshooting and change qualification. - Understanding of semiconductor fabrication processes and packaging technologies. - Familiarity with equipment install and qualification. - Experience with optimization of procedures or design for safety, quality, and cost-effective manufacturability.
This role has been open 149 days — well above the 59-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
302
|
Median days open
59 d
|
Median salary
$167k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Intel Corporation | All employers we track in this specialty (302 roles · 59 employers) |
|---|---|---|
| Open roles in this specialty | 20 | 302 |
| Open roles in the wider Process, Fab & Equipment family | 192 | 10039 · 106 employers |
| Median days open | 28 d | 59 d (−31 d vs this employer) |
| Median salary (USD postings) | — | $167k |
Who's hiring in this category
- KLA Corporation · 42 open roles · median 135 d
- Micron Technology · 40 open roles · median 41 d
- Renesas Electronics · 21 open roles · median 45 d
- Intel Corporation (this employer) · 20 open roles · median 27 d
- GlobalFoundries · 14 open roles · median 67 d
- Lumilens · 13 open roles · median 78 d
How we counted: 302 open Packaging Engineering (Advanced Packaging) roles from 59 employers tracked in the SemiconductorJobs index, counted 24 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.