Packaging Module Development Engineer - Arizona, Phoenix, United States
$133,800 - $255,200 USD yearly
Originally posted 21 July 2026 by the employer. Relisted by the employer on 29 September 2026.
About the role
Intel Corporation's Substrate Packaging Technology Development (SPTD) organization is seeking a Packaging Module Development Engineer specializing in Laser and Optical Processing for its pilot line in Chandler, Arizona. The role focuses on developing and integrating laser and optical process technologies for advanced semiconductor packaging solutions.
What you'll do
- Develop and optimize laser, optical, and advanced packaging processes for semiconductor technologies. - Design and execute experiments (DOE), analyze data, and drive process improvements using scientific and statistical methods. - Support the installation, qualification, and ramp of new equipment and process technologies. - Investigate process and equipment issues, perform root-cause analysis, and implement solutions to improve yield and reliability. - Collaborate across engineering teams and document technical findings to support technology development and manufacturing readiness.
What you'll need
- Ph.D. in Optical Engineering, Optics, Photonics, Physics, Applied Physics, Electrical Engineering, Materials Science, Mechanical Engineering, or a related STEM field; OR Master's degree with 1+ years of relevant experience; OR Bachelor's degree with 3+ years of relevant industry experience in laser processing, precision equipment engineering, or semiconductor manufacturing. - Hands-on experience working with laser, optical, photonic, or related advanced processing technologies in a laboratory, manufacturing, or development environment. - Proficiency in programming or scripting tools (e.g., Python, MATLAB, JMP/JSL, C++, LabVIEW) for data analysis, process development, automation, or equipment control. - Experience applying experimental methods (DOE), statistical analysis, and data-driven problem-solving to technical challenges. - Demonstrated analytical and troubleshooting skills with a structured approach to process development.
Nice to have
- 4+ years of experience developing laser, optical, or precision micromachining processes for semiconductor, microelectronics, advanced materials, or related applications. - Understanding of laser-material interactions, such as ultrafast pulse dynamics, non-linear optical absorption, thermal vs. athermal ablation regimes, or laser-assisted surface finishing. - Experience with JMP Scripting Language (JSL) or custom scripting for automated reporting, coordinate translation, toolpath generation, or recipe automation. - Hands-on operation of 3D optical profilers, confocal microscopes, or surface metrology tools to evaluate micro-features, step heights, and surface roughness. - Familiarity with optical modeling tools or multi-physics simulation software (e.g., COMSOL, ANSYS) for thermal or optical-mechanical modeling.
This role has been open 90 days — well above the 51-day median for Hardware Systems Engineering roles.
Hardware Systems Engineering · AI ML Hardware
|
Open roles in category
966
|
Median days open
51 d
|
Median salary
$156k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Intel Corporation | All employers we track in this specialty (966 roles · 102 employers) |
|---|---|---|
| Open roles in this specialty | 76 | 966 |
| Open roles in the wider Software, Firmware & Systems family | 206 | 6166 · 145 employers |
| Median days open | 36 d | 51 d (−15 d vs this employer) |
| Median salary (USD postings) | — | $156k |
Who's hiring in this category
- Intel Corporation (this employer) · 73 open roles · median 37 d
- KLA Corporation · 65 open roles · median 45 d
- Teradyne · 57 open roles · median 31 d
- NVIDIA · 51 open roles · median 69 d
- Applied Materials · 50 open roles · median 67 d
- AMD · 47 open roles · median 51 d
How we counted: 966 open Hardware Systems Engineering (AI ML Hardware) roles from 102 employers tracked in the SemiconductorJobs index, counted 19 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Software, Firmware & Systems family row. Figures refresh nightly.