Packaging Engineering Intern - Winter - Austin, United States

Originally posted 27 August 2026 by the employer.

About the role

This role involves end-to-end process development and integration for semiconductor packaging processes. You will be actively involved in the research and development of new packaging technologies, including mechanical prototyping, experiment design, and data analysis.

What you'll do

• Design and iterate on machines and subsystems for semiconductor packaging fabrication, such as laser ablation machines, reflow ovens, and automated metal plating facilities.
• Integrate mechanical, electrical, and optical components in system assembly, including wiring, optics alignment, and electronics.
• Collaborate with cross-functional teams to improve fabrication processes and equipment.
• Perform hands-on package/wafer processing, including 3D printing, metal plating, lithography, and metrology.

What you'll need

• Currently pursuing a Bachelor’s Degree or higher in engineering.
• At least 1-2 hands-on wet lab or lab-adjacent experiences, ideally in metal plating work or fabricating devices.
• Strong foundation in mechanical engineering (Solidworks/Onshape, materials selection).
• Hands-on prototyping experience and the ability to move through design cycles quickly.
• A portfolio showcasing built projects (personal or previous internships) involving medium-to-high complexity systems.

Nice to have

• Proven experience in mechatronics or electromechanical system design.
• Familiarity with lasering and 3D printing (stereolithography).
• Experience with reliability testing, soldering, and reflow testing.
• Hands-on experience with nano-fabrication tools (etching, deposition, patterning) and metrology tools (SEM, thin film measurement, X-ray).