Packaging Engineer - Hsinchu, Taiwan
Packaging & Advanced Integration
Originally posted 5 October 2026 by the employer.
About the role
This role involves leading assembly technology development with OSAT and foundry partners.
What you'll do
- Drive OSATs to develop advanced assembly technology capabilities.
- Collaborate with integration and design teams to integrate assembly and design needs.
- Formulate plans to enhance assembly capabilities to meet design needs.
- Establish ecosystem partners to identify assembly capability improvement roadmap.
What you'll need
- In-depth process knowledge of key assembly processes: die prep, various die bond methods, underfill, lid attach.
- Hands-on experience on large module/die assembly challenges, chip on wafer/panel and chip on substrate.
- Well versed in typical technology development tools, FMEA, SPC, control plans.
- Minimum Msc in Mechanical Engineering, Electrical Engineering, Materials Science, Physics, or equivalent.
Nice to have
- Demonstrated leadership skills in managing OSATs and teams with various backgrounds.
- Ability to communicate well in both English and Chinese language.
Market context
This role has been open 1 day — well below the 60-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
311
|
Median days open
60 d
|
Median salary
$165k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | AMD | All employers we track in this specialty (311 roles · 59 employers) |
|---|---|---|
| Open roles in this specialty | 7 | 311 |
| Open roles in the wider Process, Fab & Equipment family | 48 | 9631 · 109 employers |
| Median days open | 42 d | 60 d (−18 d vs this employer) |
| Median salary (USD postings) | — | $165k |
Who's hiring in this category
- KLA Corporation · 52 open roles · median 117 d
- Micron Technology · 36 open roles · median 38 d
- Renesas Electronics · 21 open roles · median 36 d
- Infineon Technologies · 17 open roles · median 54 d
- onsemi · 15 open roles · median 27 d
- GlobalFoundries · 13 open roles · median 69 d
How we counted: 311 open Packaging Engineering (Advanced Packaging) roles from 59 employers tracked in the SemiconductorJobs index, counted 6 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.