Package / Process Development Engineer - Carmona, Cavite, Philippines
Originally posted 15 September 2026 by the employer — open 0 days.
About the role
This role involves leading R&D initiatives focused on die preparation processes and collaborating with cross-functional teams to integrate new process technologies.
What you'll do
- Lead R&D initiatives focused on die preparation processes including laser groove / ablation, mechanical dicing, and stealth dicing.
- Design and conduct experiments to develop and refine packaging processes.
- Analyze experimental data to identify trends and optimize process parameters.
- Develop comprehensive process documentation and control plans.
- Address and resolve complex process-related challenges.
- Mentor and provide technical leadership to junior engineers and team members.
What you'll need
- Bachelor's or Master's degree in Electrical Engineering, Materials Science, Mechanical Engineering, or a related field.
- Minimum of 8 years of experience in semiconductor package assembly process development.
- In-depth knowledge of wafer singulation processes, semiconductor packaging technologies and materials.
Nice to have
- Experience in Project Management.
- Familiar with Project Management concepts and tools.
Skills: die preparation processes, laser groove / ablation, mechanical dicing, stealth dicing, semiconductor package assembly process development
This role has been open 0 days — well below the 56-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
292
|
Median days open
56 d
|
Median salary
$180k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | onsemi | All employers we track in this specialty (292 roles · 55 employers) |
|---|---|---|
| Open roles in this specialty | 11 | 292 |
| Open roles in the wider Process, Fab & Equipment family | 268 | 9344 · 109 employers |
| Median days open | 77 d | 56 d (+21 d vs this employer) |
| Median salary (USD postings) | — | $180k |
Skills observed across this category: die preparation processes, laser groove / ablation, mechanical dicing, stealth dicing, semiconductor package assembly process development
Who's hiring in this category
- KLA Corporation · 51 open roles · median 96 d
- Micron Technology · 28 open roles · median 35 d
- Renesas Electronics · 21 open roles · median 15 d
- Infineon Technologies · 20 open roles · median 35 d
- Intel Corporation · 17 open roles · median 63 d
- Lumilens · 13 open roles · median 39 d
How we counted: 292 open Packaging Engineering (Advanced Packaging) roles from 55 employers tracked in the SemiconductorJobs index, counted 15 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.