Package Development Engineer - Scottsdale, AZ, United States
Originally posted 15 September 2026 by the employer — open 0 days.
About the role
This role involves leading the development and commercialization of advanced embedded packaging technologies. This includes embedded passives, active devices, and high-density substrate integration.
What you'll do
- Lead the development and commercialization of advanced embedded packaging technologies.
- Develop embedded package architectures, defining substrate stack-ups, interconnect schemes, thermal solutions, and package design rules.
- Lead process development for embedding, lamination, laser drilling, metallization, and assembly.
- Drive package qualification and reliability assessments in accordance with JEDEC, IPC, and customer requirements.
- Partner with OSATs, substrate suppliers, and material vendors to establish scalable manufacturing solutions.
- Conduct root cause analysis and implement yield, quality, and cost improvements.
What you'll need
- BS/MS in Electrical, Mechanical, Materials, Chemical Engineering, or related field.
- 8+ years of semiconductor package development experience.
- Expertise in embedded packaging, substrate technologies, and advanced interconnects.
- Strong knowledge of package reliability, failure analysis, and manufacturing processes.
- Experience with DOE, statistical analysis, and process optimization.
- Experience working with OSATs, substrate suppliers, and material vendors.
- Proficiency in engineering tools and methodologies, including ACAD, 8D, SPC, DFMEA, DOE.
Skills: semiconductor package development, embedded packaging, substrate technologies, advanced interconnects, package reliability
This role has been open 0 days — well below the 56-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
292
|
Median days open
56 d
|
Median salary
$180k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | onsemi | All employers we track in this specialty (292 roles · 55 employers) |
|---|---|---|
| Open roles in this specialty | 11 | 292 |
| Open roles in the wider Process, Fab & Equipment family | 268 | 9344 · 109 employers |
| Median days open | 77 d | 56 d (+21 d vs this employer) |
| Median salary (USD postings) | — | $180k |
Skills observed across this category: semiconductor package development, embedded packaging, substrate technologies, advanced interconnects, package reliability
Who's hiring in this category
- KLA Corporation · 51 open roles · median 96 d
- Micron Technology · 28 open roles · median 35 d
- Renesas Electronics · 21 open roles · median 15 d
- Infineon Technologies · 20 open roles · median 35 d
- Intel Corporation · 17 open roles · median 63 d
- Lumilens · 13 open roles · median 39 d
How we counted: 292 open Packaging Engineering (Advanced Packaging) roles from 55 employers tracked in the SemiconductorJobs index, counted 15 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.