Package Development Engineer - Taiwan
Packaging & Advanced Integration
Originally posted 8 September 2026 by the employer — open 2 days.
About the role
This role involves leading the development, qualification, and manufacturing release of advanced flip-chip packaging solutions.
What you'll do
- Lead package development from concept through production release.
- Develop and optimize substrate-based (FC-BGA, FC-LGA) and leadframe-based flip-chip package technologies.
- Drive package architecture, material selection, assembly process development, and manufacturability improvements.
- Support flip-chip integration, including bumping, underfill, reflow, molding, and singulation process optimization.
- Develop qualification plans and assess package reliability performance.
- Lead root-cause investigations and corrective actions for package, assembly, and reliability issues.
What you'll need
- BS/MS in Electrical Engineering, Mechanical Engineering, Materials Science, or related field.
- 8+ years of semiconductor package development experience.
- Strong expertise in Flip-chip packaging technologies, including FC-BGA, FC-LGA, FC-QFN, FC-DFN, DrMOS, and SPS packages.
- Expertise in leadframe and substrate packaging processes.
- Expertise in Package reliability and qualification.
- Knowledge of DOE, DFMEA, SPC, 8D, and statistical problem-solving methodologies.
- Experience working with OSATs, substrate suppliers, and material vendors.
- Proficiency in engineering tools such as ACAD, 8D, SPC, and DOE.
Market context
This role has been open 1 day — well below the 59-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
289
|
Median days open
59 d
|
Median salary
$180k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | onsemi | All employers we track in this specialty (289 roles · 54 employers) |
|---|---|---|
| Open roles in this specialty | 9 | 289 |
| Open roles in the wider Process, Fab & Equipment family | 264 | 9211 · 109 employers |
| Median days open | 84 d | 59 d (+25 d vs this employer) |
| Median salary (USD postings) | — | $180k |
Who's hiring in this category
- KLA Corporation · 49 open roles · median 96 d
- Micron Technology · 26 open roles · median 35 d
- Infineon Technologies · 25 open roles · median 34 d
- Renesas Electronics · 21 open roles · median 15 d
- Intel Corporation · 16 open roles · median 50 d
- Lumilens · 12 open roles · median 34 d
How we counted: 289 open Packaging Engineering (Advanced Packaging) roles from 54 employers tracked in the SemiconductorJobs index, counted 10 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.