Package Development Engineer - San Jose, CA, United States
$150,000 - $249,780 USD yearly
Originally posted 9 September 2026 by the employer — open 1 day.
This role focuses on Multi-Phase Power Module, DrMOS, and Smart Power Stage (SPS) packages.
About the role
This role involves leading the development and qualification of advanced multi-Phase Power Module, DrMOS, and Smart Power Stage (SPS) packages.
What you'll do
- Lead package development from concept through production release.
- Define package architecture, materials selection, and assembly process flow.
- Develop and optimize substrate designs including stack-up, routing, power planes, via structures, and thermal features.
- Drive flip-chip integration, bump design, underfill selection, and assembly process optimization.
- Lead package qualification and reliability testing per JEDEC and IPC standards.
- Collaborate with OSATs and suppliers on DFM, process development, yield improvement, and cost reduction.
What you'll need
- BS/MS in Electrical Engineering, Materials Science, Mechanical Engineering, or related field.
- 10+ years of semiconductor package development experience.
- Strong expertise in Multi-Phase Power Modules, DrMOS, and SPS packaging.
- Strong expertise in advanced substrate design and manufacturing.
- Strong expertise in flip-chip assembly and package integration.
- Experience working with OSATs, substrate suppliers, and material vendors.
- Proficiency in engineering tools and methodologies, including ACAD, 8D, SPC, DFMEA, DOE.
Nice to have
- Strong expertise in passive component assembly and optimization.
- Strong expertise in thermal management and reliability engineering.
- Strong expertise in high-volume manufacturing and NPI processes.
Skills: package development, power module, substrate design, flip-chip integration, reliability qualification
This role has been open 0 days — well below the 68-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
201
|
Median days open
68 d
|
Median salary
$159k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | onsemi | All employers we track in this specialty (201 roles · 45 employers) |
|---|---|---|
| Open roles in category | 6 | 201 |
| Median days open | 87 d | 68 d (+19 d vs this employer) |
| Median salary (USD postings) | — | $159k |
Skills observed across this category: package development, power module, substrate design, flip-chip integration, reliability qualification
Who's hiring in this category
- Infineon Technologies · 28 open roles · median 30 d
- Micron Technology · 22 open roles · median 132 d
- Renesas Electronics · 18 open roles · median 39 d
- Monolithic Power Systems · 12 open roles · median 174 d
- Intel Corporation · 11 open roles · median 139 d
- onsemi (this employer) · 6 open roles · median 86 d
How we counted: 201 open Packaging Engineering (Packaging) roles from 45 employers tracked in the SemiconductorJobs index, counted 10 Sept 2026. Figures refresh nightly.