Skip to main content
Intel Corporation

Package Design Electrical Engineer - Malaysia

Intel Corporation Remote friendly (2 Locations, Malaysia) 1 day ago
Packaging & Advanced Integration

Originally posted 5 October 2026 by the employer.

About the role

This role involves managing the overall package design electrical work, ensuring it meets electrical performance requirements.

What you'll do

  • Manage the overall package design electrical work, schedule, and key milestones.
  • Gather input requirements from customers.
  • Perform electrical analysis, including signal integrity analysis and power delivery analysis.
  • Provide recommendations for package design parameters to meet electrical requirements.
  • Publish electrical design reports and obtain sign-offs from customers.
  • Drive efficiencies and innovations in electrical analysis to improve cost, schedule, efficiency, and quality.

What you'll need

  • Bachelor, Master, or PhD degree in Electrical/Electronics Engineering.
  • Strong technical knowledge of electrical field theories and electronic fundamentals.
  • Experience using Electrical Design Analysis software tools such as Ansys (HFSS, Q3D, SIwave) or Cadence Sigrity.
  • Experience using Package/Board CAD layout software tools such as Cadence Allegro or Mentor Expedition.
  • Strong project management skills and multitasking.
  • Strong technical problem solving and root causing problems.

Skills: package design, electrical analysis, signal integrity analysis, power delivery analysis, Cadence Allegro

Market context

This role has been open 1 day — well below the 61-day median for Packaging Engineering roles.

Packaging Engineering · Packaging

Open roles in category
196
Median days open
61 d
Median salary
$161k
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
How Intel Corporation compares in Packaging Engineering hiring
Metric Intel Corporation All employers we track in this specialty (196 roles · 44 employers)
Open roles in this specialty 9 196
Open roles in the wider Process, Fab & Equipment family 168 9631 · 109 employers
Median days open 161 d 61 d (+100 d vs this employer)
Median salary (USD postings) — $161k

Skills observed across this category: package design, electrical analysis, signal integrity analysis, power delivery analysis, Cadence Allegro

Who's hiring in this category

  • Infineon Technologies · 25 open roles · median 47 d
  • Renesas Electronics · 22 open roles · median 37 d
  • Micron Technology · 20 open roles · median 143 d
  • onsemi · 13 open roles · median 20 d
  • Monolithic Power Systems · 11 open roles · median 200 d
  • Intel Corporation (this employer) · 9 open roles · median 161 d

How we counted: 196 open Packaging Engineering (Packaging) roles from 44 employers tracked in the SemiconductorJobs index, counted 6 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.

Apply now
2 Locations, Malaysia
Hybrid
1 day ago

Share this job