Originally posted 27 May 2026 by the employer.
Focused on high-density non-volatile memory path-finding and RRAM device integration within Advanced Technology Development.
About the role
This role is within the Advanced Technology Development group at Texas Instruments, focused on high-density non-volatile memory (NVM) device path-finding and development activities. You will contribute to component definition, device fabrication, and technology delivery for emerging memory devices.
What you'll do
- Execute bitcell design and process integration for high-density NVM technologies. - Define and generate SWR/DOE experiments and test structures. - Perform device characterization, electrical testing, and device simulation. - Conduct data analysis and establish design rule generation for NVM devices. - Collaborate across disciplines including process, design, failure analysis, and fabrication facilities.
What you'll need
- Master’s degree in Electrical Engineering or a related discipline. - 3+ years of relevant experience. - Experience with emerging NVM technologies, especially RRAM. - Experience with NVM technologies operation and electrical testing. - Knowledge of semiconductor and memory device physics, including NVM devices.
Nice to have
- Ph.D. in Electrical Engineering or related degree. - Understanding of CMOS and memory process flows and device integration. - Circuit design engineering experience. - Knowledge of Spectre simulation and Cadence design/layout tools. - Knowledge of data analysis tools including JMP, Spotfire, Dataware, and scripting languages such as PERL and Python.
Skills: RRAM, bitcell design, process integration, device characterization, nvm technologies
This role has been open 149 days — well above the 60-day median for Process Integration roles.
Process Integration · Process Integration
|
Open roles in category
245
|
Median days open
60 d
|
Median salary
$158k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Texas Instruments | All employers we track in this specialty (245 roles · 38 employers) |
|---|---|---|
| Open roles in this specialty | 6 | 245 |
| Open roles in the wider Process, Fab & Equipment family | 252 | 10039 · 106 employers |
| Median days open | 43 d | 60 d (−17 d vs this employer) |
| Median salary (USD postings) | — | $158k |
Skills observed across this category: RRAM, bitcell design, process integration, device characterization, nvm technologies
Who's hiring in this category
- Micron Technology · 92 open roles · median 63 d
- GlobalFoundries · 35 open roles · median 45 d
- Intel Corporation · 12 open roles · median 20 d
- Infineon Technologies · 9 open roles · median 17 d
- NXP Semiconductors · 8 open roles · median 92 d
- onsemi · 8 open roles · median 51 d
How we counted: 245 open Process Integration (Process Integration) roles from 38 employers tracked in the SemiconductorJobs index, counted 24 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.
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