New College Grad - RAM RDA Process Engineer - Boise, ID - Main Site, United States

Originally posted 1 October 2026 by the employer.

About the role

As a Realtime Defect Analysis (RDA) HVM Process Engineer, you will identify, investigate, and resolve process and defect-related challenges in a high-volume manufacturing environment.

What you'll do

• Review and analyze process flows, inspection data, and manufacturing metrics to identify defect trends, process anomalies, and yield-impacting issues.
• Investigate process excursions and support root cause analysis activities to drive corrective and preventive actions.
• Monitor baseline health indicators and process control metrics to maintain process stability and manufacturing performance.
• Apply statistical analysis and data-driven methodologies to identify opportunities for defect reduction and process improvement.
• Support experimentation activities and evaluate results to drive process optimization and learning.

What you'll need

• Bachelor's degree in Electrical Engineering, Chemical Engineering, Materials Science and Engineering, Mechanical Engineering, Physics, Computer Engineering, Data Science, or a related STEM discipline.
• Strong analytical and problem-solving skills.
• Ability to work effectively in a collaborative team environment.
• Effective verbal and written communication skills.
• Demonstrated willingness to learn, adapt, and grow in a manufacturing environment.
• Passion for innovation, continuous improvement, and technical problem solving.

Nice to have

• Internship, co-op, undergraduate research, or senior project experience related to engineering, semiconductor manufacturing, data analytics, or process improvement.
• Exposure to data analysis, scripting, programming, or automation tools such as Python, SQL, JMP, Power BI, MATLAB, R.
• Interest in leveraging artificial intelligence (AI), machine learning, automation, and digital manufacturing tools to improve engineering workflows and manufacturing outcomes.
• Understanding of statistical process control (SPC), root cause analysis (RCA), experimental design, or continuous improvement methodologies.
• Experience with semiconductor processing, metrology, inspection systems, defect analysis, or yield improvement activities.
• Exposure to data analytics, programming, automation, or artificial intelligence (AI) tools, with a demonstrated interest in applying AI-driven insights and data-driven methodologies.

Skills: defect analysis, yield improvement, defect reduction, process excursions, root cause analysis, inspection systems