New College Grad - HBM Design Architect | MS or PhD - Richardson, TX, United States
Originally posted 25 September 2026 by the employer.
About the role
This role involves evaluating and developing future HBM and DRAM architectures.
What you'll do
- Analyze HBM and DRAM architectures using analytical models, simulations, silicon data, and AI-assisted techniques.
- Develop and apply modeling, simulation, and data-analysis methodologies for architectural assessment and technology pathfinding.
- Collaborate with architecture, circuit design, layout, packaging, product, and system teams to evaluate implementation feasibility and performance tradeoffs.
- Perform root-cause analysis using simulation and measured data to improve model accuracy and validate assumptions.
- Communicate technical findings through presentations, design reviews, architecture discussions, and written documentation.
What you'll need
- Master's or Ph.D. degree in Electrical Engineering, Computer Engineering, or a related field.
- Strong foundation in at least two of the following: CMOS circuits, digital or mixed-signal design, semiconductor devices, computer architecture, memory systems, thermal sciences, signal integrity, power delivery, or advanced packaging.
- Experience developing engineering models, simulations, or analytical methodologies.
- Demonstrated ability to evaluate complex technical problems and communicate recommendations effectively.
- Strong analytical, problem-solving, written communication, and verbal communication skills.
Nice to have
- Graduate research, internship, thesis, dissertation, or project experience related to HBM, DRAM, SRAM, memory controllers, high-speed interfaces, semiconductor architecture, or 3D integration technologies.
- Experience with engineering simulation and analysis tools such as HSPICE, FineSim, Spectre.
- Understanding of power, performance, area, timing, thermal, and reliability tradeoffs in advanced semiconductor designs.
- Experience using data analytics, AI, Large Language Models (LLMs), or Generative AI technologies to enhance engineering productivity.
- Technical communication experience demonstrated through publications, conference presentations, patents, research reviews, or design reports.
Skills: HBM and DRAM architectures, analytical models, silicon data, architecture, circuit design, layout, 3D integration technologies
This role has been open 9 days — well below the 69-day median for Memory Design roles.
Memory Design · Memory Design
|
Open roles in category
287
|
Median days open
69 d
|
Median salary
$205k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Micron Technology | All employers we track in this specialty (287 roles · 29 employers) |
|---|---|---|
| Open roles in this specialty | 153 | 287 |
| Median days open | 86 d | 69 d (+17 d vs this employer) |
| Median salary (USD postings) | — | $205k |
Skills observed across this category: HBM and DRAM architectures, analytical models, silicon data, architecture, circuit design, layout, 3D integration technologies
Who's hiring in this category
- Micron Technology (this employer) · 151 open roles · median 86 d
- Synopsys · 27 open roles · median 49 d
- SanDisk · 17 open roles · median 32 d
- Broadcom · 16 open roles · median 50 d
- Qualcomm · 12 open roles · median 149 d
- NVIDIA · 7 open roles · median 59 d
How we counted: 287 open Memory Design (Memory Design) roles from 29 employers tracked in the SemiconductorJobs index, counted 5 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there. Figures refresh nightly.