RF, Wireless & Photonics
$98,000 - $176,000 USD yearly
Originally posted 2 October 2026 by the employer.
About the role
This role involves ownership of process integration from development, customer engagement to production for 300mm semiconductor manufacturing. The position focuses on SiPh process development in various technologies including RF, FinFET technologies, FDSOI, and eNVM.
What you'll do
- Develop SiPh processes in various technologies including RF, FinFET technologies, FDSOI, and eNVM.
- Collaborate with process module and device teams to drive process solutions.
- Oversee project scope and ensure all technical needs are met, working with Product Line and Business Unit teams.
- Support all Environmental, Health, Safety & Security requirements and programs.
What you'll need
- Bachelor's, Master's, or Ph.D. Degree in Electrical Engineering, Materials Science, Solid State Physics or other relevant engineering physical science discipline.
- Minimum 6 years of working experience in a relevant field.
- Experience leading an engineering team, developing, and delivering advanced technology for mass production.
- Strong project management skills, particularly focused on managing schedules, scope, and cost trade-offs.
- Excellent interpersonal skills, both oral and written.
Nice to have
- Ph.D. with 1 year working experience in a relevant field in Electrical Engineering, Materials Science, Solid State Physics or other relevant engineering physical science discipline.
- Experience in FEOL/BEOL processes with Planar, FinFET and FDSOI technology.
- Results-oriented and focused on quality of work.
- Knowledge of Lean Manufacturing principles.
- Strong presentation and technical writing skills.
Skills: SiPh process development, process integration, FinFET technologies, FDSOI, mass production
USA - New York - Malta, United States
On-site
$98,000 - $176,000 USD yearly
3 days ago