MTB ASSEMBLY PROCESS ENGINEER - Taichung - MTB, Taiwan
Packaging & Advanced Integration
Originally posted 4 October 2026 by the employer.
About the role
This role involves establishing, monitoring, and optimizing daily assembly process parameters to ensure stable production lines and leading troubleshooting for manufacturing defects.
What you'll do
- Establish, monitor, and optimize daily assembly process parameters.
- Lead containment and root-cause analysis of manufacturing defects and process abnormalities.
- Implement Statistical Process Control (SPC) to reduce process variation.
- Drive yield enhancement and prevent quality excursions.
- Author and update standard operating procedures (SOPs), failure mode and effects analysis (FMEA), and technical reports.
- Collaborate with equipment, product, and quality engineering teams to resolve technical bottlenecks.
What you'll need
- Master’s degree (M.S.) in Engineering, Electrical Engineering, Physics, or a related STEM discipline.
- 0 to 2 years of experience in semiconductor manufacturing, packaging, or assembly processes.
- Fundamental understanding of semiconductor packaging processes (e.g., Wafer Mount, Wafer Singulation, Laser Groove).
- Proficiency in statistical analysis software (e.g., JMP, Minitab).
- Familiarity with SPC, DOE (Design of Experiments), and FMEA methodologies.
- Basic knowledge of failure analysis tools and techniques (e.g., OM, SEM, EDX, SAT).
- Solid written and verbal communication skills in English.
Market context
This role has been open 1 day — well below the 61-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
196
|
Median days open
61 d
|
Median salary
$161k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Micron Technology | All employers we track in this specialty (196 roles · 44 employers) |
|---|---|---|
| Open roles in this specialty | 20 | 196 |
| Open roles in the wider Process, Fab & Equipment family | 1486 | 9631 · 109 employers |
| Median days open | 143 d | 61 d (+82 d vs this employer) |
| Median salary (USD postings) | — | $161k |
Who's hiring in this category
- Infineon Technologies · 25 open roles · median 47 d
- Renesas Electronics · 22 open roles · median 37 d
- Micron Technology (this employer) · 20 open roles · median 143 d
- onsemi · 13 open roles · median 20 d
- Monolithic Power Systems · 11 open roles · median 200 d
- Intel Corporation · 9 open roles · median 161 d
How we counted: 196 open Packaging Engineering (Packaging) roles from 44 employers tracked in the SemiconductorJobs index, counted 6 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.