Module Engineering PhD Intern Summer 2027 - Oregon, Hillsboro, United States
$120,898 - $120,902 USD yearly
Originally posted 15 September 2026 by the employer.
Join a team focused on diffusion and implantation processes within semiconductor manufacturing.
About the role
This role involves contributing to the development and optimization of manufacturing processes for a specific module within semiconductor production. You will work within a team focused on diffusion and implantation processes.
What you'll do
- Support the development and implementation of semiconductor manufacturing processes for a specific module.
- Sustain and improve manufacturing equipment performance, ensuring operational efficiency and reliability.
- Assist in equipment troubleshooting and qualification activities to meet production standards.
- Collaborate with engineering teams to optimize process control methodologies and achieve production targets.
- Apply statistical analysis and design experiments to enhance process reliability and throughput.
- Gain hands-on experience in materials and device characterization techniques, such as SEM and TEM.
What you'll need
- Ph.D. degree in progress in Materials Science, Chemical Engineering, Chemistry, Physics, Electrical Engineering, or a related STEM field.
- Hands-on experience or knowledge of semiconductor processing fundamentals, including lithography, etching, polishing, and deposition techniques.
- Familiarity with statistical data analysis and design of experiments methodologies.
- Experience in materials and physical device characterization, such as SEM or TEM.
Nice to have
- Advanced transistor device structures and architectures including fabrication (Atomic Layer Deposition, Chemical Vapor Deposition, Rapid Thermal Annealing, Ion Implantation, Surface treatments and modification) with in-depth knowledge of semiconductor device physics and process integration.
- Technical skills such as scripting languages (Python, JSL, Perl, TCL) or programming languages (SQL, C/C++).
- Semiconductor processing fundamentals (lithography, wet etch, dry etch, chemical and or mechanical polishing).
- Design of experiments and data analysis expertise.
- Expertise in Materials and physical device characterization (SEM, TEM) and fundamentals of semiconductor device testing.
- Process control systems, methodologies, sources of variability, and statistics.
This role has been open 31 days — well below the 50-day median for Hardware Systems Engineering roles.
Hardware Systems Engineering · AI ML Hardware
|
Open roles in category
966
|
Median days open
50 d
|
Median salary
$156k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Intel Corporation | All employers we track in this specialty (966 roles · 102 employers) |
|---|---|---|
| Open roles in this specialty | 73 | 966 |
| Open roles in the wider Software, Firmware & Systems family | 205 | 6119 · 145 employers |
| Median days open | 35 d | 50 d (−15 d vs this employer) |
| Median salary (USD postings) | — | $156k |
Who's hiring in this category
- Intel Corporation (this employer) · 74 open roles · median 35 d
- KLA Corporation · 65 open roles · median 43 d
- Teradyne · 57 open roles · median 29 d
- NVIDIA · 52 open roles · median 67 d
- Applied Materials · 50 open roles · median 65 d
- AMD · 47 open roles · median 49 d
How we counted: 966 open Hardware Systems Engineering (AI ML Hardware) roles from 102 employers tracked in the SemiconductorJobs index, counted 17 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Software, Firmware & Systems family row. Figures refresh nightly.