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Intel Corporation

Module Engineering PhD Intern - Oregon, Hillsboro, United States

Intel Corporation US, Oregon, Hillsboro, United States Internship 1 month ago
Digital Design & SoC Architecture

$120,898 - $120,902 USD yearly

Originally posted 10 September 2026 by the employer.

This role focuses on advancing Intel's semiconductor manufacturing technology.

About the role

As a Module Engineering PhD Intern, you will play a critical role in advancing Intel's semiconductor manufacturing technology. In this position, you will work on challenging, hands-on projects that support the development, implementation, optimization, and continuous improvement of manufacturing processes within a specific process module.

What you'll do

  • Support the development, implementation, and optimization of semiconductor manufacturing processes.
  • Troubleshoot, sustain, and qualify manufacturing equipment to improve process stability, yield, and operational efficiency.
  • Collaborate with engineering teams to develop and enhance process control methodologies.
  • Conduct experiments, analyze data, and identify opportunities for process improvements.
  • Participate in root cause investigations and implement corrective actions.
  • Present technical findings, recommendations, and project results to engineering stakeholders.

What you'll need

  • Active pursuit of a PhD degree in Engineering, Materials Science, Physics, Chemistry, Chemical Engineering, Electrical Engineering, Mechanical Engineering, or a related STEM field.
  • 3+ months of educational, research, laboratory, internship, or industry experience.
  • Demonstrated hands-on experience through academic research, laboratory work, internships, coursework, or technical projects.
  • Basic understanding of semiconductor manufacturing processes, process integration, or advanced manufacturing methodologies.

Nice to have

  • Experience with data analysis, statistical methods, and process optimization techniques.
  • Proficiency in Machine Learning, Python, SQL, or other data analysis tools.
  • Experience conducting research or developing technical solutions within semiconductor manufacturing, process engineering, or related fields.
Market context

This role has been open 36 days — well below the 50-day median for Hardware Systems Engineering roles.

Hardware Systems Engineering · AI ML Hardware

Open roles in category
966
Median days open
50 d
Median salary
$156k
See the full market breakdown ▾Category comparison, and who else is hiring
How Intel Corporation compares in Hardware Systems Engineering hiring
Metric Intel Corporation All employers we track in this specialty (966 roles · 102 employers)
Open roles in this specialty 73 966
Open roles in the wider Software, Firmware & Systems family 205 6119 · 145 employers
Median days open 35 d 50 d (−15 d vs this employer)
Median salary (USD postings) — $156k

Who's hiring in this category

  • Intel Corporation (this employer) · 74 open roles · median 35 d
  • KLA Corporation · 65 open roles · median 43 d
  • Teradyne · 57 open roles · median 29 d
  • NVIDIA · 52 open roles · median 67 d
  • Applied Materials · 50 open roles · median 65 d
  • AMD · 47 open roles · median 49 d

How we counted: 966 open Hardware Systems Engineering (AI ML Hardware) roles from 102 employers tracked in the SemiconductorJobs index, counted 17 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Software, Firmware & Systems family row. Figures refresh nightly.

Apply now
US, Oregon, Hillsboro, United States
On-site
Internship
$120,898 - $120,902 USD yearly
1 month ago

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