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Intel Corporation

Module Engineering (PhD Intern) - Oregon, Hillsboro, United States

Intel Corporation US, Oregon, Hillsboro, United States Internship 11 days ago
Digital Design & SoC Architecture

$120,898 - $120,902 USD yearly

Originally posted 5 October 2026 by the employer.

About the role

As a Module Engineering PhD Intern, you will develop and optimize semiconductor manufacturing processes for a specific module.

What you'll do

  • Support the development and implementation of manufacturing processes for a specific module in semiconductor production.
  • Sustain and enhance manufacturing equipment performance to ensure operational reliability and efficiency.
  • Assist in troubleshooting equipment issues and performing qualification activities.
  • Collaborate with engineering teams to optimize process control methodologies and enhance process efficiency.
  • Apply statistical analysis and experimental design to improve process reliability and throughput.
  • Gain hands-on experience with materials and device characterization techniques, such as SEM and TEM.

What you'll need

  • Currently pursuing a Ph.D. degree in Materials Science, Chemical Engineering, Chemistry, Physics, Electrical Engineering, or another STEM-related field.
  • Knowledge of semiconductor processing fundamentals, including lithography, etching, polishing, and deposition techniques.
  • Familiarity with statistical data analysis and experimental design methodologies.
  • Experience in materials and physical device characterization techniques like SEM or TEM, gained through coursework, academic research, or hands-on training.

Nice to have

  • Expertise in advanced semiconductor device structures, fabrication techniques, and process integration.
  • Proficiency in statistical analysis tools and programming languages such as JMP, Python, MATLAB, or C++.
  • Hands-on research experience in device fabrication, physical characterization, or materials testing.
  • Strong foundational knowledge in process control systems and semiconductor device physics.
Market context

This role has been open 10 days — well below the 51-day median for Hardware Systems Engineering roles.

Hardware Systems Engineering · AI ML Hardware

Open roles in category
953
Median days open
51 d
Median salary
$156k
See the full market breakdown ▾Category comparison, and who else is hiring
How Intel Corporation compares in Hardware Systems Engineering hiring
Metric Intel Corporation All employers we track in this specialty (953 roles · 102 employers)
Open roles in this specialty 71 953
Open roles in the wider Software, Firmware & Systems family 201 6156 · 145 employers
Median days open 34 d 51 d (−17 d vs this employer)
Median salary (USD postings) — $156k

Who's hiring in this category

  • Intel Corporation (this employer) · 68 open roles · median 34 d
  • KLA Corporation · 64 open roles · median 44 d
  • Teradyne · 56 open roles · median 28 d
  • NVIDIA · 51 open roles · median 67 d
  • Applied Materials · 49 open roles · median 64 d
  • AMD · 47 open roles · median 48 d

How we counted: 953 open Hardware Systems Engineering (AI ML Hardware) roles from 102 employers tracked in the SemiconductorJobs index, counted 16 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Software, Firmware & Systems family row. Figures refresh nightly.

Apply now
US, Oregon, Hillsboro, United States
On-site
Internship
$120,898 - $120,902 USD yearly
11 days ago

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