Module Engineering PhD Intern - Arizona, Phoenix, United States
$120,898 - $120,902 USD yearly
Originally posted 12 September 2026 by the employer.
About the role
As a Module Engineering PhD Intern, you will conduct fundamental research and experimentation to characterize materials and assess their feasibility for product applications within Assembly Technology Development.
What you'll do
- Conduct fundamental research and experimentation to characterize materials, identify potential failure modes, and understand structure-property-performance relationships.
- Collaborate closely with materials suppliers to develop and source material formulations.
- Develop a comprehensive understanding of Intel's assembly processes, material interactions, and their impact on overall product performance.
- Partner with Equipment and Process Engineering teams to implement material technologies on test vehicles and products.
- Design and develop assembly processes and equipment by applying innovative concepts and novel solutions.
What you'll need
- Ph.D. degree in Materials Science and Engineering, Chemical Engineering, Chemistry, Polymer Science, Polymer Chemistry, Metallurgy or related technical fields.
- 6+ months of relevant experience in fundamental research and experimentation.
This role has been open 33 days — well below the 50-day median for Hardware Systems Engineering roles.
Hardware Systems Engineering · AI ML Hardware
|
Open roles in category
964
|
Median days open
50 d
|
Median salary
$155k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Intel Corporation | All employers we track in this specialty (964 roles · 103 employers) |
|---|---|---|
| Open roles in this specialty | 68 | 964 |
| Open roles in the wider Software, Firmware & Systems family | 191 | 6147 · 145 employers |
| Median days open | 33 d | 50 d (−17 d vs this employer) |
| Median salary (USD postings) | — | $155k |
Who's hiring in this category
- Intel Corporation (this employer) · 71 open roles · median 33 d
- KLA Corporation · 65 open roles · median 42 d
- Teradyne · 55 open roles · median 27 d
- NVIDIA · 52 open roles · median 67 d
- Applied Materials · 49 open roles · median 63 d
- AMD · 45 open roles · median 44 d
How we counted: 964 open Hardware Systems Engineering (AI ML Hardware) roles from 103 employers tracked in the SemiconductorJobs index, counted 15 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Software, Firmware & Systems family row. Figures refresh nightly.