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Intel Corporation

Module Development Defect Metrology Engineer - Oregon, Hillsboro, United States

Intel Corporation US, Oregon, Hillsboro, United States 3 days ago
Digital Design & SoC Architecture

$155,520 - $219,550 USD yearly

Originally posted 8 October 2026 by the employer.

About the role

This role focuses on developing and optimizing manufacturing metrology defect inspection tools for high-volume production at Intel. This includes new tool selection, process integration, and equipment solutions within Intel's Advanced Packaging Technology Development organization.

What you'll do

  • Lead the development of advanced manufacturing metrology defect inspection tools, including new tool selection and automation optimization.
  • Drive process and hardware development of defect inspection tools to enable high-volume manufacturing.
  • Develop and execute technology roadmaps for future manufacturing needs.
  • Optimize production efficiency, manufacturing techniques, and output for tools.
  • Leverage statistical process control and data analytics to enhance process stability.
  • Implement modifications to operational equipment to improve efficiency and scalability.

What you'll need

  • Bachelor's degree in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Chemistry, Physics, or a related STEM field with 6+ years of semiconductor experience OR Master's degree in the same fields with 4+ years of semiconductor experience OR PhD in the same fields with 2+ years of semiconductor experience.
  • 2+ years of experience in manufacturing process development, statistical process control, and process improvement methodologies.
  • Hands-on experience in wafer-level assembly, semiconductor processing, or advanced packaging technology in developing defect inspection method.

Nice to have

  • Experience in metrology for advanced packaging technologies, such as hybrid bonded interconnects, ultra-fine pitch solder connections, or RDL-based packaging.
Market context

This role has been open 2 days — well below the 50-day median for Hardware Systems Engineering roles.

Hardware Systems Engineering · AI ML Hardware

Open roles in category
940
Median days open
50 d
Median salary
$158k
See the full market breakdown ▾Category comparison, and who else is hiring
How Intel Corporation compares in Hardware Systems Engineering hiring
Metric Intel Corporation All employers we track in this specialty (940 roles · 103 employers)
Open roles in this specialty 70 940
Open roles in the wider Software, Firmware & Systems family 187 6025 · 146 employers
Median days open 30 d 50 d (−20 d vs this employer)
Median salary (USD postings) — $158k

Who's hiring in this category

  • Intel Corporation (this employer) · 70 open roles · median 30 d
  • KLA Corporation · 59 open roles · median 39 d
  • Applied Materials · 50 open roles · median 59 d
  • NVIDIA · 49 open roles · median 65 d
  • Teradyne · 48 open roles · median 23 d
  • AMD · 43 open roles · median 59 d

How we counted: 940 open Hardware Systems Engineering (AI ML Hardware) roles from 103 employers tracked in the SemiconductorJobs index, counted 11 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Software, Firmware & Systems family row. Figures refresh nightly.

Apply now
US, Oregon, Hillsboro, United States
On-site
$155,520 - $219,550 USD yearly
3 days ago

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