Advanced Packaging Process Integration Engineer - Sr. Staff - Kissimmee, FL 34744, USA
Originally posted 20 October 2026 by the employer.
Lead integrated process flow development across Si interposers, FanOut, and hybrid bonding technologies.
About the role
As a Process Integration Engineer, you will lead, develop, and improve an overall integrated advanced packaging process flow to deliver qualified products to foundry clients. The role spans Si interposer, FanOut, and hybrid bonding manufacturing process flows from initial proof of concept through product qualification and transfer to volume manufacturing.
What you'll do
- Translate client package specifications into integrated flows utilizing Si interposer, FanOut, and hybrid bonding techniques. - Develop comprehensive process flows across toolsets including temporary and permanent bonding, electrolytic and PVD metal deposition, dielectric deposition, photolithography, etch, CMP, bake, reflow, flip chip, and wire bond. - Integrate TSV first and TSV last process flows to support foundry client packaging needs. - Collaborate with CAD engineers to validate incoming layout files and construct frames with metrology structures and electrical test structures. - Monitor inline and end-of-line SPC charts and electrical test parametrics, driving integration and recipe changes to resolve excursions and improve yield. - Partner with failure analysis and process teams to investigate root causes, validate experimental recipes via DOE, and support full-scale production transfers.
What you'll need
- BS in Engineering (MS or PhD preferred). - 7+ years of Process Development & Integration Engineer experience in an advanced packaging fab or semiconductor fab environment focused on FanOut wafer level assembly and hybrid bonding. - Hands-on knowledge and experience with advanced packaging fab processing tools. - Device and integration knowledge spanning MEMS, photonics, HPC, AI, ASIC, or quantum devices. - Applied knowledge of DOE, SPC, and 6-sigma methodologies. - US Citizenship, with the ability to obtain a government security clearance.
This role has been open 2 days — well below the 61-day median for Process Integration roles.
Process Integration · Advanced Packaging
|
Open roles in category
86
|
Median days open
61 d
|
Median salary
$187k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | SkyWater Technology | All employers we track in this specialty (86 roles · 21 employers) |
|---|---|---|
| Open roles in this specialty | 12 | 86 |
| Open roles in the wider Process, Fab & Equipment family | 86 | 10073 · 106 employers |
| Median days open | 2 d | 61 d (−59 d vs this employer) |
| Median salary (USD postings) | — | $187k |
Who's hiring in this category
- Micron Technology · 18 open roles · median 37 d
- SkyWater Technology (this employer) · 12 open roles · median 2 d
- GlobalFoundries · 11 open roles · median 122 d
- Applied Materials · 8 open roles · median 36 d
- Intel Corporation · 8 open roles · median 83 d
- Renesas Electronics · 7 open roles · median 38 d
How we counted: 86 open Process Integration (Advanced Packaging) roles from 21 employers tracked in the SemiconductorJobs index, counted 23 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.
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