Mechanical Engineering Intern - Richardson, TX, United States
$31 USD hourly
Originally posted 30 August 2026 by the employer.
This internship supports the Qorvo Defense & Aerospace product lines.
About the role
This internship involves mechanical design tasks for product development and numerical model analysis for thermal characterization within Qorvo's High Performance Analog business group.
What you'll do
- Contribute to Qorvo Defense & Aerospace product lines through mechanical design.
- Design electronics packaging components.
- Create 3D modeling of product assemblies.
- Source and procure custom designed hardware.
- Perform numerical model analysis and thermal characterization.
- Conduct Thermal FEA modeling to identify potential performance risks.
- Use Infrared thermography to determine product temperatures.
- Perform Structural FEA modeling to quantify component stresses.
What you'll need
- Currently pursuing a BS or MS in Mechanical Engineering.
- Minimum GPA of 3.0.
- 3D CAD experience (preference with SolidWorks).
- Previous 101 level coursework in programming.
- FEA or CFD modeling experience.
- Previous coursework in heat & mass transfer.
- Previous coursework in statics.
- Previous coursework in mechanics of materials.
This role has been open 28 days — well below the 48-day median for Hardware Systems Engineering roles.
Hardware Systems Engineering · AI ML Hardware
|
Open roles in category
847
|
Median days open
48 d
|
Median salary
$159k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | QORVO | All employers we track in this specialty (847 roles · 102 employers) |
|---|---|---|
| Open roles in this specialty | 9 | 847 |
| Open roles in the wider Software, Firmware & Systems family | 29 | 5854 · 143 employers |
| Median days open | 28 d | 48 d (−20 d vs this employer) |
| Median salary (USD postings) | — | $159k |
Who's hiring in this category
- Intel Corporation · 59 open roles · median 20 d
- NVIDIA · 55 open roles · median 52 d
- KLA Corporation · 50 open roles · median 42 d
- Teradyne · 44 open roles · median 50 d
- AMD · 43 open roles · median 55 d
- Applied Materials · 41 open roles · median 67 d
How we counted: 847 open Hardware Systems Engineering (AI ML Hardware) roles from 102 employers tracked in the SemiconductorJobs index, counted 28 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Software, Firmware & Systems family row. Figures refresh nightly.