$130,000 USD yearly
Originally posted 28 April 2026 by the employer.
About the role
The Manager of Process Engineering manages a team of opto-mechanical process engineers responsible for subassembly development and assembly build for R&D and volume system integration and deployment at quantum computer sites. The position covers packaging, processing, and assembly of electronics and silicon photonics chips on PCBAs for cryogenic and room temperature vacuum systems.
What you'll do
- Design and develop assembly process flows and build subassemblies for quantum computer subsystems integrating electronics and silicon photonics chips on PCBAs for cryogenic and room temperature vacuum systems. - Finalize designs and assembly process flows using DFM, DFQ, and FMEA tools in collaboration with cross-functional teams and suppliers to meet subsystem requirements. - Deliver and verify tooling, fixtures, and equipment with suppliers, completing process development and buyoffs with process capability analysis. - Release design documentation, work instructions, and control plans with change controls, and transfer qualified processes to operations for volume assembly build. - Manage in-house processes with the Operations team, oversee contract manufacturing for external operations, and provide process technical support. - Oversee budgets, capital expenditures, hiring per annual operating plan, deliverables, milestones, and supplier execution schedules.
What you'll need
- Master’s degree or higher in an applicable engineering discipline, such as Process Engineering, Mechanical Engineering, Optical Engineering, or Applied Physics. - 10+ years of experience applying engineering principles to solve complex opto-mechanical assembly process problems. - Hands-on experience with optical and photonics assembly and inspection equipment, processes, and material systems, including die attach, wire bonding, optical coupling, flip chip, and underfill. - Working knowledge of opto-mechanical packaging and assembly equipment, piece-part supplier bases, and quality systems. - Experience with subsystem design, analysis, and assembly, building NPI pilot lines, transferring processes to operations, and supporting manufacturing.
Nice to have
- Experience managing opto-mechanical process teams taking products to volume in datacom, telecom, or optical communications. - Supplier and contract manufacturing management experience.
Skills: Process Engineering, silicon photonics, quantum computing, semiconductor manufacturing, process development
This role has been open 179 days — well above the 60-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
300
|
Median days open
60 d
|
Median salary
$167k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | PsiQuantum | All employers we track in this specialty (300 roles · 59 employers) |
|---|---|---|
| Open roles in this specialty | 2 | 300 |
| Open roles in the wider Process, Fab & Equipment family | 10 | 10039 · 106 employers |
| Median days open | 157 d | 60 d (+97 d vs this employer) |
| Median salary (USD postings) | — | $167k |
Skills observed across this category: Process Engineering, silicon photonics, quantum computing, semiconductor manufacturing, process development
Who's hiring in this category
- KLA Corporation · 42 open roles · median 136 d
- Micron Technology · 40 open roles · median 42 d
- Renesas Electronics · 21 open roles · median 46 d
- Intel Corporation · 20 open roles · median 28 d
- GlobalFoundries · 14 open roles · median 68 d
- Lumilens · 13 open roles · median 79 d
How we counted: 300 open Packaging Engineering (Advanced Packaging) roles from 59 employers tracked in the SemiconductorJobs index, counted 25 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.