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Micron Technology

Intern - PIE PI (Product Integration Engineering, Process Integration) - Fab 10N/X, Singapore

Micron Technology Fab 10N/X, Singapore Full-time 17 days ago
Process & Device Engineering

Originally posted 18 September 2026 by the employer — open 1 day.

About the role

This internship provides a structured learning opportunity within the Process Integration Engineering team, focusing on advanced semiconductor memory manufacturing technologies.

What you'll do

  • Gain exposure to advanced semiconductor memory technologies, including NAND, DRAM, and HBM products.
  • Learn how process integration teams drive product quality, reliability, and manufacturing excellence.
  • Develop practical understanding of reliability engineering methodologies and failure trend analysis.
  • Apply data analytics and AI/ML concepts to engineering challenges.
  • Observe cross-functional collaboration among Process Integration, Process Development, Manufacturing, Yield Enhancement, Product Engineering, and Failure Analysis teams.
  • Build technical problem-solving, communication, and analytical skills in a high-volume manufacturing environment.

What you'll need

  • Basic understanding of semiconductor fabrication processes (preferred).
  • Interest in manufacturing technology, reliability engineering, data analytics, or process optimization.
  • Willingness to learn and collaborate in a team environment.

Skills: process integration, device reliability, NAND, DRAM, HBM, failure mechanisms

Market context

This role has been open 1 day — well below the 53-day median for Process Integration roles.

Process Integration · Process Integration

Open roles in category
217
Median days open
53 d
Median salary
$161k
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
How Micron Technology compares in Process Integration hiring
Metric Micron Technology All employers we track in this specialty (217 roles · 36 employers)
Open roles in this specialty 76 217
Open roles in the wider Process, Fab & Equipment family 1454 9328 · 108 employers
Median days open 54 d 53 d (+1 d vs this employer)
Median salary (USD postings) — $161k

Skills observed across this category: process integration, device reliability, NAND, DRAM, HBM, failure mechanisms

Who's hiring in this category

  • Micron Technology (this employer) · 76 open roles · median 54 d
  • GlobalFoundries · 24 open roles · median 88 d
  • Intel Corporation · 14 open roles · median 53 d
  • onsemi · 9 open roles · median 38 d
  • Infineon Technologies · 8 open roles · median 38 d
  • Renesas Electronics · 8 open roles · median 51 d

How we counted: 217 open Process Integration (Process Integration) roles from 36 employers tracked in the SemiconductorJobs index, counted 19 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.

Apply now
Fab 10N/X, Singapore
On-site
Full-time
17 days ago

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