Intern, NPI Packaging Engineer - Fall 2026 - San Diego, CA, United States
pSemi
San Diego, CA, United States
Internship
13 days ago
Packaging & Advanced Integration
Originally posted 22 September 2026 by the employer.
About the role
This position assists with design and prototype assembly of new RFIC products during the product development phase.
What you'll do
- Participate in the design of bump, package, and assembly process flow for new products for use in high volume, high reliability, industrial, commercial, and automotive applications.
- Use data analysis to drive design decisions.
- Prepare design documentation and bill of materials for chip fabrication, backend wafer processes, and component assembly.
- Execute DoE experiments, collecting characterization data to substantiate design decisions and mitigate technical risk.
- Support failure analysis and problem resolution in the development process or production environment.
What you'll need
- Fulltime enrollment in an accredited Bachelor's degree program in Mechanical Engineering, Materials Science Engineering or equivalent (completing 3+ year) or MSME candidate.
- Hands on experience with design tools such as AutoCAD.
- Familiarity with DOE methodology.
- Demonstrated ability to collect accurate experimental data, basic data analysis and plotting.
- Basic understanding of robot machinery.
Nice to have
- Hands on experience with manufacturing equipment and processing.
Market context
This role has been open 0 days — well below the 56-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
297
|
Median days open
56 d
|
Median salary
$172k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | pSemi | All employers we track in this specialty (297 roles · 57 employers) |
|---|---|---|
| Open roles in this specialty | 2 | 297 |
| Open roles in the wider Process, Fab & Equipment family | 6 | 9479 · 109 employers |
| Median days open | 38 d | 56 d (−18 d vs this employer) |
| Median salary (USD postings) | — | $172k |
Who's hiring in this category
- KLA Corporation · 50 open roles · median 104 d
- Micron Technology · 36 open roles · median 34 d
- Infineon Technologies · 19 open roles · median 43 d
- Renesas Electronics · 19 open roles · median 23 d
- onsemi · 15 open roles · median 14 d
- Lumilens · 13 open roles · median 47 d
How we counted: 297 open Packaging Engineering (Advanced Packaging) roles from 57 employers tracked in the SemiconductorJobs index, counted 23 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.