Intern - Memory Design Engineer, HBM - Richardson, TX, United States
Originally posted 5 October 2026 by the employer.
Work on advanced HBM products as part of the High Bandwidth Memory (HBM) Design team.
About the role
As an HBM Design Engineer Intern, you will work alongside experienced engineers on the design, development, and validation of advanced HBM products within the High Bandwidth Memory (HBM) Design team.
What you'll do
- Assist with HBM memory and logic design activities, including RTL development, circuit implementation, simulation, verification, and functional analysis.
- Develop and use scripting, automation, and AI-assisted workflows to improve design productivity, debug efficiency, and design-flow quality.
- Perform timing, power, and functional analysis of HBM subsystems and support design reviews, technical investigations, and root-cause analysis.
- Collaborate with Design Verification, Physical Design, CAD, and Product Engineering teams to support project execution and product development.
- Document technical work, experimental results, build methodologies, and AI-assisted insights.
What you'll need
- Currently pursuing a Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, Computer Science, or a related technical field.
- Completed coursework in Digital Logic Design, CMOS Circuits, Computer Architecture, VLSI Design, or Semiconductor Devices.
- Demonstrated understanding of combinational and sequential logic design concepts.
- Familiarity with Verilog, SystemVerilog, or VHDL.
- Programming experience in Python, Perl, Tcl, C/C++, or similar languages.
- Strong analytical, debugging, and problem-solving skills.
Nice to have
- Knowledge of memory architectures such as DRAM, SRAM, DDR, LPDDR, or HBM.
- Experience with RTL design, simulation, synthesis, timing analysis, or verification methodologies.
- Familiarity with Linux/Unix environments, scripting, and semiconductor EDA tools such as VCS, Xcelium, Questa, PrimeTime, Innovus, or Virtuoso.
- Understanding of functional coverage, design verification concepts, and semiconductor development flows.
- Previous academic, research, or internship experience involving VLSI, ASIC, FPGA, memory design, or the application of Artificial Intelligence (AI) tools to enhance engineering productivity and analysis.
Skills: HBM memory, logic design, RTL development, circuit implementation, simulation
This role has been open 0 days — well below the 69-day median for Memory Design roles.
Memory Design · Memory Design
|
Open roles in category
287
|
Median days open
69 d
|
Median salary
$205k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Micron Technology | All employers we track in this specialty (287 roles · 29 employers) |
|---|---|---|
| Open roles in this specialty | 153 | 287 |
| Median days open | 86 d | 69 d (+17 d vs this employer) |
| Median salary (USD postings) | — | $205k |
Skills observed across this category: HBM memory, logic design, RTL development, circuit implementation, simulation
Who's hiring in this category
- Micron Technology (this employer) · 151 open roles · median 86 d
- Synopsys · 27 open roles · median 49 d
- SanDisk · 17 open roles · median 32 d
- Broadcom · 16 open roles · median 50 d
- Qualcomm · 12 open roles · median 149 d
- NVIDIA · 7 open roles · median 59 d
How we counted: 287 open Memory Design (Memory Design) roles from 29 employers tracked in the SemiconductorJobs index, counted 5 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there. Figures refresh nightly.