Intern - Design Engineer, HBM - Richardson, TX, United States
Originally posted 21 September 2026 by the employer.
High Bandwidth Memory (HBM) and DRAM solutions for AI and HPC applications.
About the role
As an HBM Memory Design Engineer, you will design, analyze, and optimize digital, analog, and memory circuits used in High Bandwidth Memory (HBM) products. This role focuses on developing high-performance DRAM solutions for AI, HPC, and data-centric applications.
What you'll do
- Design, analyze, and optimize memory, logic, and analog circuits for HBM products.
- Perform circuit verification, parasitic modeling, and design simulations using industry-standard tools.
- Collaborate with layout, CAD, modeling, and verification teams.
- Partner with Product Engineering, Test, Probe, Process Integration, Assembly, and Marketing teams to support product development.
What you'll need
- Pursuing a Bachelor’s degree in Electrical Engineering, Computer Engineering, or a related technical field.
- Working knowledge of CMOS circuit design fundamentals and semiconductor device physics.
- Experience with schematic entry and circuit simulation tools such as FineSim and/or HSPICE.
- Familiarity with Verilog modeling, simulation environments, power network analysis, and state machine logic.
- Experience with scripting languages such as Python, TCL, or Perl.
Nice to have
- Knowledge of DRAM architecture, memory design concepts, and SoC/IO interfaces.
- Experience using AI Agents, Generative AI, or other AI-Assisted engineering productivity tools.
Skills: HBM, DRAM, memory circuits, CMOS circuit design, circuit simulation, Verilog modeling
This role has been open 13 days — well below the 69-day median for Memory Design roles.
Memory Design · Memory Design
|
Open roles in category
287
|
Median days open
69 d
|
Median salary
$205k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Micron Technology | All employers we track in this specialty (287 roles · 29 employers) |
|---|---|---|
| Open roles in this specialty | 153 | 287 |
| Median days open | 86 d | 69 d (+17 d vs this employer) |
| Median salary (USD postings) | — | $205k |
Skills observed across this category: HBM, DRAM, memory circuits, CMOS circuit design, circuit simulation, Verilog modeling
Who's hiring in this category
- Micron Technology (this employer) · 151 open roles · median 86 d
- Synopsys · 27 open roles · median 49 d
- SanDisk · 17 open roles · median 32 d
- Broadcom · 16 open roles · median 50 d
- Qualcomm · 12 open roles · median 149 d
- NVIDIA · 7 open roles · median 59 d
How we counted: 287 open Memory Design (Memory Design) roles from 29 employers tracked in the SemiconductorJobs index, counted 5 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there. Figures refresh nightly.