Intern 2027 - DRAM Customer Enablement Engineering - Taichung - Fab 16, Taiwan
Originally posted 17 August 2026 by the employer.
About the role
This Intern role supports the DRAM Customer Enablement team by validating, characterizing, and enabling new DRAM products across various computing platforms. The position focuses on bringing Micron's latest DRAM innovations to customers.
What you'll do
- Assist with bring-up and validation of new server, client, and/or mobile platforms using Micron's latest DRAM technologies.
- Support system-level testing, characterization, and debugging of memory-related issues.
- Analyze large datasets collected from lab systems and customer environments to identify trends, reliability concerns, and performance insights.
- Develop and improve software tools that automate testing, analysis, and reporting workflows.
- Collaborate with engineers investigating DRAM reliability, fault management, and system behavior in hyperscale and AI computing environments.
What you'll need
- Currently pursuing a Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, Computer Science, Data Science, or a related technical field.
- Basic programming experience in Python, C/C++, or similar languages.
- Strong analytical and problem-solving abilities.
- Ability to work effectively in a collaborative team environment.
- Excellent written and verbal communication skills.
- Curiosity, initiative, and willingness to learn new technologies.
Nice to have
- Coursework or experience in computer architecture, memory systems, or semiconductor devices.
- Experience developing software with Python.
- Familiarity with Linux environments.
- Experience using AI-assisted development tools such as Claude Code, GitHub Copilot, Cursor, or Roo Code.
- Knowledge of data analysis, visualization, or statistical techniques.
- Exposure to SQL, cloud platforms, or large-scale data processing.
- Understanding of server hardware, system validation, or performance benchmarking.
Skills: DRAM, memory technologies, platform bring-up, system-level testing, characterization, AI-assisted software development
This role has been open 49 days — well below the 69-day median for Memory Design roles.
Memory Design · Memory Design
|
Open roles in category
287
|
Median days open
69 d
|
Median salary
$205k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Micron Technology | All employers we track in this specialty (287 roles · 29 employers) |
|---|---|---|
| Open roles in this specialty | 153 | 287 |
| Median days open | 86 d | 69 d (+17 d vs this employer) |
| Median salary (USD postings) | — | $205k |
Skills observed across this category: DRAM, memory technologies, platform bring-up, system-level testing, characterization, AI-assisted software development
Who's hiring in this category
- Micron Technology (this employer) · 151 open roles · median 86 d
- Synopsys · 27 open roles · median 49 d
- SanDisk · 17 open roles · median 32 d
- Broadcom · 16 open roles · median 50 d
- Qualcomm · 12 open roles · median 149 d
- NVIDIA · 7 open roles · median 59 d
How we counted: 287 open Memory Design (Memory Design) roles from 29 employers tracked in the SemiconductorJobs index, counted 5 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there. Figures refresh nightly.