Skip to main content
Intel Corporation

Intel Foundry Process Development Engineer - Advanced Lithography - Oregon, Hillsboro, United States

Intel Corporation Remote friendly (US, Oregon, Hillsboro, United States) 13 days ago
Process & Device Engineering

$133,800 - $188,890 USD yearly

Originally posted 22 September 2026 by the employer.

About the role

This senior-level Process Engineering role involves developing advanced semiconductor process technologies within the Logic Technology Development (LTD) organization.

What you'll do

  • Lead scientific research for manufacturing innovative device architectures.
  • Design, execute, and analyze experiments to meet process engineering specifications.
  • Participate in the development of intellectual property.
  • Integrate individual steps for complex microprocessor manufacturing.
  • Ramp to manufacturing volumes and transfer technology to manufacturing via the Copy Exactly Methodology.

What you'll need

  • Bachelor's degree with 7+ years, Master's degree with 5+ years, or Ph.D. with 3+ years of experience in Materials Science, Chemical Engineering, Chemistry, Physics, Mechanical Engineering, Electrical Engineering, or a related Scientific STEM field.
  • Experience in semiconductor processing, semiconductor fabrication, or nanotechnology.
  • Experience with Design of Experiments (DOE).
  • Experience with Statistical Process Control (SPC).
  • Computational data skills.
  • 3+ years of professional overlay development experience and understanding of process induced overlay impacts, OR 3+ years of professional scanner, track, or lithography metrology tool experience, OR 3+ years of professional lithography process layer development experience, OR 3+ years of EUV materials process development experience.
  • Understanding of modern semiconductor manufacturing processes.

Nice to have

  • Proven experience driving integrated process change methodologies to develop a robust process.
  • Demonstrated ability to utilize coding to facilitate data collection and analysis.
  • Equipment development and vendor interaction experience.
  • Experience with ASML scanner EUV and DUV platforms.
  • Familiarity with factory automation or manufacturing control systems.

Skills: process technology, lithography, EUV materials, semiconductor fabrication, design of experiments

Market context

This role has been open 0 days — well below the 82-day median for Process Engineering roles.

Process Engineering · Semiconductor Process

Open roles in category
1033
Median days open
82 d
Median salary
$148k
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
How Intel Corporation compares in Process Engineering hiring
Metric Intel Corporation All employers we track in this specialty (1033 roles · 60 employers)
Open roles in this specialty 12 1033
Open roles in the wider Process, Fab & Equipment family 175 9479 · 109 employers
Median days open 84 d 82 d (+2 d vs this employer)
Median salary (USD postings) — $148k

Skills observed across this category: process technology, lithography, EUV materials, semiconductor fabrication, design of experiments

Who's hiring in this category

  • Micron Technology · 347 open roles · median 139 d
  • Applied Materials · 83 open roles · median 139 d
  • GlobalFoundries · 70 open roles · median 92 d
  • Texas Instruments · 48 open roles · median 35 d
  • STMicroelectronics · 43 open roles · median 69 d
  • Entegris · 41 open roles · median 28 d

How we counted: 1033 open Process Engineering (Semiconductor Process) roles from 60 employers tracked in the SemiconductorJobs index, counted 23 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.

Apply now
US, Oregon, Hillsboro, United States
Hybrid
$133,800 - $188,890 USD yearly
13 days ago

Share this job