HPC Product Development Engineer - Milpitas, CA, United States
$95,000 - $161,500 USD yearly
Originally posted 10 June 2026 by the employer.
About the role
This role assists in the development and maintenance of customized Windows OS images aligned with KLA's hardware and software requirements. You will support system configuration, diagnostics, and deployment within the LS-SWIFT division for wafer inspection platforms.
What you'll do
- Assist in the development and maintenance of customized Windows OS images aligned with hardware and software requirements. - Use PowerShell scripting to automate system configuration and basic diagnostic tasks. - Support the development of diagnostic scripts that integrate with existing diagnostic suites for system troubleshooting. - Apply a test-driven or validation-focused approach to improve reliability and maintainability. - Create and update technical documentation for processes, configurations, and tools. - Collaborate with multi-functional teams—including hardware engineering, software development, and system integration—on Windows-based system deployment in production environments.
What you'll need
- Foundational knowledge of computer systems, including basic understanding of computer hardware, operating systems, or networking concepts. - Exposure to scripting or programming languages through coursework, labs, internships, or personal projects (such as PowerShell, Python, Bash, or similar). - Interest in Windows operating system internals, configuration, and automation. - Ability to write clear technical documentation and follow established processes.
This role has been open 135 days — well above the 59-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
305
|
Median days open
59 d
|
Median salary
$167k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | KLA Corporation | All employers we track in this specialty (305 roles · 59 employers) |
|---|---|---|
| Open roles in this specialty | 42 | 305 |
| Open roles in the wider Process, Fab & Equipment family | 512 | 10080 · 106 employers |
| Median days open | 134 d | 59 d (+75 d vs this employer) |
| Median salary (USD postings) | — | $167k |
Who's hiring in this category
- KLA Corporation (this employer) · 44 open roles · median 134 d
- Micron Technology · 40 open roles · median 43 d
- Renesas Electronics · 21 open roles · median 44 d
- Intel Corporation · 19 open roles · median 29 d
- GlobalFoundries · 14 open roles · median 66 d
- Lumilens · 13 open roles · median 77 d
How we counted: 305 open Packaging Engineering (Advanced Packaging) roles from 59 employers tracked in the SemiconductorJobs index, counted 23 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.