HBM Architect - San Jose, CA, United States
$150,000 - $320,000 USD yearly
Originally posted 28 July 2026 by the employer.
This role focuses on HBM architecture.
About the role
This role involves designing circuits for DRAM and HBM products and improving their quality and yield during development. This work centers on HBM architecture.
What you'll do
- Design circuits for DRAM and HBM products to meet specifications.
- Improve design quality and yield during DRAM or HBM product development.
- Perform characteristic analysis and verify product specifications at Wafer, KGSD, and Assembly stages.
- Enhance performance and ensure stable operation for customer requirements during product development.
What you'll need
- Bachelor’s degree or higher in Electrical Engineering or a related discipline.
- 3+ years of relevant industry experience.
- Experience reviewing and designing DRAM or HBM Architecture with a solid understanding of DRAM/HBM subsystems.
- Experience in Full Custom + Digital Co-Design and PDN analysis.
- Experience in Full Custom-based Logic Foundry design.
- Experience with various tools and equipment for DRAM or HBM product failure analysis.
Nice to have
- Extensive experience in product development and analysis related to DRAM or HBM design.
- Experience in HBM product assembly system analysis.
- Experience in Full Custom Design environments with advanced process nodes (DRAM 1x nm, Foundry 3nm or below).
- Proficiency in using Python, Spotfire, Verilog, and Circuit Simulators (Hspice, Csim, PrimeSim, Spectre, etc.).
Skills: HBM architecture, 3D-stacked DRAM, DRAM subsystems, Full Custom + Digital Co-Design, PDN analysis, circuit simulators
This role has been open 68 days — below the 69-day median for Memory Design roles.
Memory Design · Memory Design
|
Open roles in category
287
|
Median days open
69 d
|
Median salary
$205k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | SK Hynix America | All employers we track in this specialty (287 roles · 29 employers) |
|---|---|---|
| Open roles in this specialty | 5 | 287 |
| Median days open | 68 d | 69 d (−1 d vs this employer) |
| Median salary (USD postings) | — | $205k |
Skills observed across this category: HBM architecture, 3D-stacked DRAM, DRAM subsystems, Full Custom + Digital Co-Design, PDN analysis, circuit simulators
Who's hiring in this category
- Micron Technology · 151 open roles · median 86 d
- Synopsys · 27 open roles · median 49 d
- SanDisk · 17 open roles · median 32 d
- Broadcom · 16 open roles · median 50 d
- Qualcomm · 12 open roles · median 149 d
- NVIDIA · 7 open roles · median 59 d
How we counted: 287 open Memory Design (Memory Design) roles from 29 employers tracked in the SemiconductorJobs index, counted 5 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there. Figures refresh nightly.